Electronics Forum | Mon Jun 08 20:03:07 EDT 1998 | Dave F
| Chiakl | Ion Chromatography has been perfectly described by Dave, but here are a couple of extra considerations: | Ion Chromatography will tell you precisely what is present on the surface of your board/assembly but it will not tell you whether it
Electronics Forum | Mon Oct 22 17:37:51 EDT 2001 | davef
I�m aware of no such standard. There may be something in Euroland [ie, IEC, etc.] TM-650 �Test Methods Manual� has procedures for measuring various types of contamination, such as: * 2.2.25 �Detection Of Ionizable Surface Contaminants� * 2.2.27 �Cl
Electronics Forum | Tue Aug 13 20:58:06 EDT 2002 | davef
Peterson: Ionic flux residues when combined with moisture and a voltage differential can plate conductive �fingers� on the surface of a PCB, but that doesn�t sound like what�s going on here. Your NC flux should not be particularly conductive. For
Electronics Forum | Wed Jun 02 16:33:08 EDT 2004 | davem
Fuji is the best, but there are other alternatives besides Quad. If you really want to look at Fuji, take a peek at their XP142E series. With "Vision processing on the fly" and a "Mini Turret Head" with 12 placement nozzles it should fit your needs n
Electronics Forum | Sun Jul 03 12:16:58 EDT 2005 | jh0n!
128MB in any system is ridiculous these days. While we have some machines at work on the production floor that only have 128 - they're only used to view BOM's, etc. Check http://www.pricewatch.com and buy yourself 1GB of RAM for no more than $100.
Electronics Forum | Fri Oct 27 12:54:04 EDT 2006 | mika
Hi, This a common problem with the GSM P2P cameras, once in a while chip gets between the "protecting?" glass and the led-cards surronding it. It has happen to us several times (we have 2.6 & 4 mil/pixel cameras ring lighting, but it is the same lig
Electronics Forum | Thu Jul 24 03:33:30 EDT 2014 | edriansyah
Hi All.. I need your advice, when you send your boards to be analized by external lab, what kind of result would you expect from them? Do you expect them to find the root cause of the problem and give countermeasure of the problem? (this is what I e
Electronics Forum | Mon Jul 24 20:39:49 EDT 2017 | dawson
We got an inquiry from US that requires high > volume 8 layer 1.0mm PCB, OSP + selective ENIG > surface, 5 groups impedance control, and stacked > vias. These requirements are common, but there is > 2/2mil lines in inner layers. It's said that th
Electronics Forum | Wed Jun 17 17:53:48 EDT 2020 | aveazey
We've got a GSM1 running OS2/WARP version 4.5.0 and we ran into having placement issues for all components. Each placement seems to be exactly 30 mils offset from it's actual location. We've got a 2.6 mil/px and a 4.0 mil/px camera. Attached is an
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
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