Electronics Forum | Fri Jun 05 19:20:25 EDT 1998 | Rin
| Our company is currently looking to implement a SMT production line. What I am looking for is feedback on people's experiences with various machines. | Here's what we are in the market for: | Low/Mid volume 3,000+cph machine that can handle high j
Electronics Forum | Tue May 14 20:25:02 EDT 2002 | russ
Hello All, I've got a little problem here. I have a 456 ball PBGA 1mm pitch, .5mm balls, with .6mm pads on the board. given that the pad size is way to big (S/B .45mm or so)I need any and all advice on how to rework these things without shorting o
Electronics Forum | Mon Nov 03 03:20:25 EST 2003 | magdelectronics
Hello Cal, I have left Tempo and started my own business. We manufacture a carrier tape like that of Surftape. Mag-D Electronics Adhesive Back Carrier Tape has a punched Blue Nitto Tape Gap and not two rails. Our Punched Nitto carrier is more acc
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Thu Jun 01 00:20:25 EDT 2023 | ultraview
We are using a Kayo-A4 SMT machine and are running across software bugs we can't seem to work around. Video here: https://youtu.be/PSobXzTtcH0 I push next and the camera goes to the correct location for part J2. Then I push test and the part is picke
Electronics Forum | Wed Feb 23 20:25:17 EST 2000 | Chris Wallace
Like all who post messages here, I'm looking for a little bit (well, maybe a lot of bit) of help. We're currently going through a redesign of a board which will utilize several FPGAs. The manufacturer (Xilinx) recommends using solder mask defined p
Electronics Forum | Wed Feb 23 20:25:17 EST 2000 | Chris Wallace
Like all who post messages here, I'm looking for a little bit (well, maybe a lot of bit) of help. We're currently going through a redesign of a board which will utilize several FPGAs. The manufacturer (Xilinx) recommends using solder mask defined p
Electronics Forum | Wed Jul 22 11:20:25 EDT 1998 | Russ Miculich
Barbara, I worked for 5 years with advanced materials including silver filled thermoplastics and epoxies for Alphametals. There is a trend towards lead free "solder paste". Some companies are using an Indium alloy paste and others are using a "lea
Electronics Forum | Mon Jun 29 13:51:29 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Mon Jun 29 13:50:48 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU