Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail
This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -
Electronics Forum | Fri May 17 11:00:57 EDT 2002 | Sam Chiocca
Demand Wave Solutions has an inventory control module, BOSSgoldIC, that can be integrated with your present ERP system or implemented individually on an open architecture platform. It is on-line, interactive inventory management system that provides
Electronics Forum | Wed Feb 23 10:36:37 EST 2005 | Indy
Hi Rob, I had tried printig anisotropic conductive adhesive as a replacement for solder paste. Following were my finding. Adv: - curing temp is around 120-150C as compared to 217C (Pb-free) solder. - good electrical conductivity, since it is usual
Electronics Forum | Fri Dec 09 07:10:36 EST 2005 | Mity-C
Good Morning, One problem of LF BGA's in a leaded process is the temps required to propperly collapse the BGA balls. If the BGA is LF, the alloy of the balls will not reflow until the temp reaches 217-245 C. SN 63/37 reflows at 183 C. If your profil
Electronics Forum | Sat Apr 15 09:07:22 EDT 2006 | samir
Amol, We pulled off this "hybrid profile" with a leaded solder paste. We recently got our tensile test report results, and our Pb-Free BGA / Pb Paste sample broke off during tensile tests at the pad/substrate interface, and not the joint. This ind
Electronics Forum | Tue May 02 07:19:29 EDT 2006 | billyd
Good morning all. I'm trying to find some help on my voiding issue on my lead free BGAs. I am using a Heller 8/2 zone oven, and using Qualitek solder paste. I had listened to a tech representing another solder company, who told me to make the joints
Electronics Forum | Wed Jun 21 07:44:31 EDT 2006 | amol_kane
Hi Muse, what do you mean by "with a SAC Ball and SnPb Paste the ball liquifies at a much higher heat"? Actually depending upon the ratio of solder contributed by the pad (SnPb) to the ratio of the SAC solder contributed by the BGA Ball, the SAC sold
Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip
Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least
Electronics Forum | Tue Jan 30 12:16:47 EST 2007 | pbarton
We are seeing unusual soldered joints when soldering to components with Pt/Ag metallised terminations. At the margin between the bottom of the component termination and the PCB surface there are a number of blowholes in the bulk solder. There also ap
Electronics Forum | Mon Feb 12 13:16:35 EST 2007 | CK the Flip Guy
Looks good at first glance. Couple of questions, though: Time Above _____. Fill in the blank. Is Liquidous 183C (Tin-Lead) or 217C to 220C (Lead Free)? The "soak" of 150-190, at 0.6*C per second ramp up looks good, weather it's lead or lead-free
