Industry News: 2mm (Page 7 of 12)

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Industry News | 2013-04-13 00:16:30.0

Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.

Hesse Mechatronics

New Dual-Head Wedge Bonder Makes Americas Debut

Industry News | 2013-06-07 14:37:14.0

Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.

Hesse Mechatronics

The Balver Zinn Group to Debut OT2 Solder Paste and BRILLIANT B2012 Wire at Productronica

Industry News | 2013-10-08 14:47:36.0

The Balver Zinn Group announces that it will exhibit in Hall A4, Stand 451 at the 20th international Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

Cobar Solder Products Inc.

Hesse Mechatronics Appoints Representative for South America

Industry News | 2014-01-24 16:21:17.0

Hesse Mechatronics has appointed HTMG as the company's sales representative for South America.

Hesse Mechatronics

ViTrox Technologies to Debut Next-Generation AOI Solution at the IPC APEX EXPO

Industry News | 2014-02-20 10:36:06.0

ViTrox Technologies will debut the new V510 Optimus 3D AOI system in booth #717 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

ViTrox Technologies

Pulse Electronics' ProxAnt TL 1.0 Package Combines a Proximity Sensor with an Antenna to Optimize both Functions

Industry News | 2015-12-16 18:26:09.0

Pulse Electronics Corporation introduces an all-in-one combination antenna and proximity sensor package to optimize the characteristics of both functions, thus enabling better device performance and increased design flexibility for tablets, laptops, and notebook computers. The ProxAnt TL 1.0 is a seven band main antenna, a proximity sensor chip, and all needed components included on the same flexible circuit board. Without requiring physical contact, the sensor recognizes when it is close to the user and sends a signal to the host processor to reduce the transmission power to the antenna, thus lowering SAR. The sensor also recognizes movement to avoid a false trigger.

Pulse Electronics

Introducing the Fuji Flexible Placement Platform "AIMEX III"

Industry News | 2016-03-16 20:57:21.0

In regard to the placement processes used for electronic circuit boards, there are ever growing calls for high-mix, as well as variable-mix and variable-volume production in order to keep up with changes in the marketplace. In order to meet these demands, Fuji developed the flexible and expandable AIMEX IIIc, which was announced in October 2015. On this occasion we would like to announce the release of the AIMEX III, a machine built with the same concepts as the AIMEX IIIc, as well as the ability to produce large panels.

FUJI CORPORATION

Reed Relay with the world’s smallest footprint to be unveiled at Semicon West

Industry News | 2017-06-29 17:52:43.0

Pickering Electronics plan to release exciting new Reed Relay, the Series 120, at Semicon West 2017, on booth 5162. The Pickering Series 120 is a range of Single Pole (1 Form A) reed relays that will require a board area of only 4mm x 4mm, making it the highest packing density currently available, taking up the smallest board area ever.

Pickering Electronics

Hanwha Techwin Rolls out a New Wave in Robotics at APEX

Industry News | 2019-01-05 16:53:35.0

Hanwha Techwin Automation Americas today announced plans to exhibit in Booth #1843 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will demonstrate the new HCR-5 Cobot and HM520 Cutting-Edge Modular Mounter.

Hanwha Techwin CO., LTD.

Hanwha Techwin Collects Two NPI Awards for Its Cutting-Edge Modular Mounter and Screen Printer at APEX

Industry News | 2019-01-30 21:02:28.0

Hanwha Techwin Automation Americas today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Hanwha Techwin CO., LTD.


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