Electronics Forum | Mon Apr 13 13:16:40 EDT 1998 | Helmut Pawelka
Dear Rick If you need additional information about dispensing adhesives or dispensing itself please visit the site below or contact me personally. Best Regards Helmut Pawelka
Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied
Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar
Electronics Forum | Mon Mar 01 13:29:43 EST 1999 | dszeto
We have customer requested machine dispension on adhesive of solder side components, however we are currently using stencil printing for adhesive. Have anyone evaluated and compared on dispension and screen printing of adhesive before? Thanks!
Electronics Forum | Wed Feb 22 10:02:08 EST 2006 | Aaj
Hi! Why positive displacement technique cannot be used for underfill dispensing? Which is the best technique to dispense underfill?
Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F
Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s
Electronics Forum | Sun Jun 04 14:14:24 EDT 2000 | James.L
1) Adhesive dispensing -number of dot per component , what's the determined factor ? What's the distribution ? 2) What is the critical factor to monitor the consistacy of volume & profile per dot ? 3) What is the effect of temperature/balance of adhe
Electronics Forum | Wed Feb 09 22:33:27 EST 2000 | Dave F
All: I don�t think this isn�t what Charlie was asking about, but since he�s got our juices flowing on the topic, does anyone have a sense about running paste and adhesive at the same time, beyond the issues that we spoke about in responding to Charl
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Mon Oct 29 10:48:39 EST 2001 | davef
If you can half-way justify the cost delta, go with the dispenser.
Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef
Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur
