Electronics Forum | Wed Sep 16 11:09:42 EDT 2009 | clampron
That will definately cause a shorter tip life. The high tin in the alloy along with the higher temps are probably your culprit. We have noticed a degredation it tip life when we changed from leaded to RoHS on standard PCB's. Good Luck Chris
Electronics Forum | Fri Sep 07 10:46:23 EDT 2001 | davef
Comments are: * Sn42Bi58 is eutectic at 138�C. Most top-flight paste suppliers will produce it for you. * Bismuth forms an alloy with lead with a melting point of 93�C * Maximum temperature of the solder connection should be less than 100�C during
Electronics Forum | Tue Nov 24 18:45:12 EST 2009 | gregoryyork
We put it in one flow soldering machine probably 12 years ago now worked really well but was extremely brittle you maybe better off with the 1% Ag alloy as its more ductile. Look at AIM Solders site if you want further information on the alloy Itis a
Electronics Forum | Tue Feb 07 13:39:42 EST 2006 | gregoryyork
You can use straight forward Tin/Copper but it flows very poorly so solderability is an issue. Dosing with Phos improves this but need to stay on top of it. We have supplied some 3.8%Ag alloys for flow they work well but you get a small 'chill point'
Electronics Forum | Mon Oct 31 19:03:49 EST 2005 | myu
We need to rework for CCGA1657 (Ceramic Column Grid Array): removal and soldering. Its size: 42.5 x 42.5 mm. Its height is 7.25 - 9.61 mm. We use 63Tin-37Lead water-soluble paste. Our mini-stencil is 6-mil with 27 mil apertures. Please show your expe
Electronics Forum | Thu Nov 19 02:22:12 EST 2009 | andrzej
Hi, we have an idea of running one side of PCB using 58Bi/42Sn solder to prevent glueing components on other side of PCB when board is on second run through SMT process. I wonder what issues we can meet once we try to use SAC305 when reworking some
Electronics Forum | Thu Nov 15 09:29:29 EST 2012 | anvil1021
Maybe this piece of information will help. In China (just returned from visit) there are many factories that are using a dual temperature process using SAC305 or Sn100C and 42/58. Apparently this allows them to run their through hole parts through re
Electronics Forum | Mon Mar 08 11:42:05 EST 2004 | Jay
Sn-Ag, Sn-Sb, and Sn-Cu based lead free alloys have a higher melting point than that of Sn-Pb eutectic system. Thus, it will be better if you can use a higher TG PCB for lead free purpose. But, also most of commercial products including SAC can be
Electronics Forum | Wed Jun 22 14:14:42 EDT 2005 | Steve
Tin/Lead we have had no problem in masking off areas on a pcb during wave soldering. Lead Free alloys, Nickel Silver Copper would there be any compatability issues with a Peelable latex solder mask containing Ammonia. Really hot need to know.
Electronics Forum | Fri Dec 15 14:42:35 EST 2006 | russ
we have has to alter some footprints to facilitate component rework/removal. We have some assemlies that have 2 oz and heavier copper, these boards require a lrger tip to melt solder so we have had to extend pads to allow the larger tips to touch pa
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