Phoenix Extra AOI for HDI and fine line PCB with min line/space down to 15 µm. Phoenix Extra, CIMS latest generation of AOI system, is designed to support high volume manufacturing of advanced HDI and fine line PCB. It is capable to scan dow
Phoenix Turbo AOI for HDI and multi-layer PCB with min line/space down to 25 µm. Phoenix Turbo, CIMS latest generation of AOI system, is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan
Phoenix FLEX/Maxima AOI for inspection of flex and rigid-flex with min line/space down to 10 µm. Phoenix FLEX/Maxima, CIMS latest generation of AOI system, is designed to support high volume manufacturing of fine line flex and rigid-flex PCB
Phoenix FLEX/Extra AOI for inspection of flex and rigid-flex with min line/space down to 15 µm. Phoenix FLEX/Extra, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capa
Phoenix R2R/Extra AOI for inspection of FPC in roll-to-roll process with min line/space down to 15 µm. Phoenix R2R/Extra, CIMS latest generation of AOI system,is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB
Phoenix FLEX/Turbo AOI for inspection of flex and rigid-flex with min line/space down to 25 µm. Phoenix FLEX/Turbo, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capa
Phoenix FLEX/HDI AOI for inspection of flex and rigid-flex with min line/space down to 30 µm. Phoenix FLEX/HDI, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable
Phoenix R2R/Turbo AOI for inspection of FPC in roll-to-roll process with min line/space down to 25 µm. Phoenix R2R/Turbo, CIMS latest generation of AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PC
Phoenix R2R/HDI AOI for inspection of FPC in roll-to-roll process with min line/space down to 30 µm. Phoenix R2R/HDI, CIMS latest generation of AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. I
Phoenix LV series AOI for laser via inspection with min diameter down to 15 µm. Phoenix LV series, CIMS latest generation of AOI system, is designed to support inspection of laser via in high volume manufacturing of HDI or IC Substrates. It
