Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker
1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre
Electronics Forum | Mon Mar 28 03:38:17 EDT 2011 | Nigel, RAKON
Graham, good idea about reflowing first. I'll try this out. Our product is Ceramic, not PCB. I'll check the reflow as you say, though I have trialed various shapes and I am in contact with stencil manufacturer regarding aperture sizing. Thanks.
Electronics Forum | Thu Jun 28 09:07:51 EDT 2007 | mika
Laser cut 0.13mm stencil thicknes works great for us. BTW, are we talking RoHS solder paste? We do reduce the stencil apertures to 88 % of the pads when we go for the RoHS solder paste. Otherwise we go fo 96% reduction in general with some excemption
Electronics Forum | Tue Mar 21 16:25:23 EST 2000 | Boca
Full radius corners on pads can help with solder paste release in the stencil. The radius shape minimizes the surface area in the wall of the stencil aperture as compared to a sharp corners. When the stencil is seperating from the pcb the solder pa
Electronics Forum | Thu Sep 09 10:09:15 EDT 1999 | John Thorup
| | | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be don
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Wed Dec 13 19:40:38 EST 2000 | Jerry Wetzel, SME, EM/SME
Your profile must be precise, your stencil aperture sizes and shapes are very important, and the size of the pads on the boards should be very close to what the part manufacturer recommends. We had some trouble with hi-temp paste, and discovered tha
Electronics Forum | Fri Aug 06 06:13:37 EDT 1999 | Wolfgang Busko
| | | | | | | | | | | | | | | | | | Hello, | | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same
Electronics Forum | Thu Jun 02 08:33:42 EDT 2016 | emeto
I usually get a excel or word file from my stencil house with all the data you need. It give you aperture sizes, volume and Aspect Area ratio... DCode Shape X-Size Y-Size Pitch Volume Area Ratio Aspect Ratio Qty D1
Electronics Forum | Fri Jun 14 14:25:05 EDT 2002 | davef
Good job clarifying things. So, your MELF are just rolling off the pads. So much for the rocket scientist that talked you into those �V� shaped apertures, eh? [Or taking it the other way: Wow, just think how bad it would be if they weren�t worki
