Electronics Forum: aperture shape (Page 7 of 16)

Solder Paste Printed Volume

Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker

1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre

Solder balls on Ceramic

Electronics Forum | Mon Mar 28 03:38:17 EDT 2011 | Nigel, RAKON

Graham, good idea about reflowing first. I'll try this out. Our product is Ceramic, not PCB. I'll check the reflow as you say, though I have trialed various shapes and I am in contact with stencil manufacturer regarding aperture sizing. Thanks.

Stencil Thickness

Electronics Forum | Thu Jun 28 09:07:51 EDT 2007 | mika

Laser cut 0.13mm stencil thicknes works great for us. BTW, are we talking RoHS solder paste? We do reduce the stencil apertures to 88 % of the pads when we go for the RoHS solder paste. Otherwise we go fo 96% reduction in general with some excemption

Re: Land Pattern Design for PLCC's, QFP's etc... in Full Radius Corners

Electronics Forum | Tue Mar 21 16:25:23 EST 2000 | Boca

Full radius corners on pads can help with solder paste release in the stencil. The radius shape minimizes the surface area in the wall of the stencil aperture as compared to a sharp corners. When the stencil is seperating from the pcb the solder pa

Re: Reflowing a thru-hole part

Electronics Forum | Thu Sep 09 10:09:15 EDT 1999 | John Thorup

| | | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be don

Solder Balls in Boards

Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324

Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,

Re: solder balls on high temp.solder

Electronics Forum | Wed Dec 13 19:40:38 EST 2000 | Jerry Wetzel, SME, EM/SME

Your profile must be precise, your stencil aperture sizes and shapes are very important, and the size of the pads on the boards should be very close to what the part manufacturer recommends. We had some trouble with hi-temp paste, and discovered tha

Re: Solder Beading Solder Balling

Electronics Forum | Fri Aug 06 06:13:37 EDT 1999 | Wolfgang Busko

| | | | | | | | | | | | | | | | | | Hello, | | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same

Auto calculate Aperture are on stnecils

Electronics Forum | Thu Jun 02 08:33:42 EDT 2016 | emeto

I usually get a excel or word file from my stencil house with all the data you need. It give you aperture sizes, volume and Aspect Area ratio... DCode Shape X-Size Y-Size Pitch Volume Area Ratio Aspect Ratio Qty D1

MELF component short togehter

Electronics Forum | Fri Jun 14 14:25:05 EDT 2002 | davef

Good job clarifying things. So, your MELF are just rolling off the pads. So much for the rocket scientist that talked you into those �V� shaped apertures, eh? [Or taking it the other way: Wow, just think how bad it would be if they weren�t worki

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