Vayo-Stencil Designer is an intelligent tool to design screen printer stencil, which is designed for company who want to achieve hign manufacturing quality. It builds stencil aperture library automatically by learning existing stencil designs; It int
Industry Directory | Manufacturer
We manufacture and market stencil rolls for the PCBA industry. The cleaning material is ideal for cleaning stencils with fine pitch apertures. It prevents smearing, solder balls and other problems on the PC boards. Our stencil product is of high g
Used SMT Equipment | Screen Printers
Two sets of blades with some poly inserts and a small roll of Ekra wiper paper; 10 support pins; A removable tool plate that can be adjusted by the leveling feet on the bottom. Was usedt to print 150um apertures so I believe it’s better than most use
Technical Library | 2018-03-07 22:41:05.0
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes 100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.
Industry Directory | Manufacturer
We manufacture laser stencil for the PCB industry.
Industry Directory | Consultant / Service Provider / Manufacturer
One of the major suppliers of stencils and pallets to the SMT industry. Stentech offers Electroformed and laser cut stencils, pallets and fixtures.
ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p
New Equipment | Solder Paste Stencils
Laser cut stainless steel stencil for solder paste printing on wafer. Wafer bumping stencils are characterized by a high number of apertures which lie close together in the size of 90µm x 110µm. A package density of up to 250000 openings is not unus
New Equipment | Solder Paste Stencils
Laser cut stainless steel stencil with etched areas. When huge open spaces have to be produced on the bottom side of a stencil, the etching technology is one opportunity to realize it. The apertures for the solder paste print process are still manuf
New Equipment | Solder Paste Stencils
Lasercut LTCC-stencil (Low Temperature Cofired Ceramic) The LTCC-technology (low temperature co-fired ceramic) is used in the hybrid-technique when several interconnection levels are realized. The connections between the layers are manufactured with
