Electronics Forum | Fri Feb 13 12:53:09 EST 1998 | Energy Technology Systems
ETS, Energy Technology Systems, would like to prove the capabilities of the CUREFLOW System (Solder Reflow and Curing Ovens)to you first hand. If your company is in the market to purchase a new reflow oven and would like to make that purchase ris
Electronics Forum | Sat Nov 08 09:42:22 EST 2003 | ethercom
Hi: I have seen this problem before. It is caused by improper curing of solder mask by the fab manufacturer. When you run the board thru' wave solder, and then wash the board, you see the problem of white residue. However, when you apply heat, you c
Electronics Forum | Fri Nov 07 12:48:31 EST 2003 | rholland
I have seen in the last couple of months more boards with a white hazing under the solder mask. I ran a few tests on a board to determine the cause of the white hazing underneath the solder mask. First I confirmed, or at least I think I confirmed, t
Electronics Forum | Thu Aug 23 00:10:21 EDT 2001 | mugen
Looky here people, 1) did imply *my* APPRECIATION for the replys posted herein... 2) If *me* appears to have no contribution to the forum, hope someone out there vaguely recalls some infrequently posted info *me* posted, that did get some joy & tha
Electronics Forum | Fri Feb 09 09:52:48 EST 2018 | jmedernach
Rather than provide an endorsement of a particular brand, I'd like to give you some factors to consider in your selection: 1.) Bottom heater capacity and capability. The bottom heater is a key driver in a successful rework process. You want to even
Electronics Forum | Wed Nov 17 11:20:23 EST 1999 | Dave F
Hey Gyver: If you don�t mind (which you don�t have any choice about, because I�m going to do it anyhow, cause it�s MY word processor), I�m going to respond genericly, but still be directed to your question. Much of the following is paraphrased from
Electronics Forum | Thu Nov 29 22:51:18 EST 2018 | jandon
IPC J-STD-001F: 6.2.1 Solder Application: Solder shall (N1D1D3) only be applied to the one side of a PTH except for intrusive soldering. Heat may be simultaneously applied to the both sides of the PTH.
Electronics Forum | Tue Oct 03 15:27:37 EDT 2000 | Wolfgang Busko
What�s wrong with your printing process and what improvement do you expect from dispensing ? I can imagine that it�s more convinient just to have this process inline, no worrying about stencils, cleaning, changing printer setting, just replacing a ca
Electronics Forum | Wed Mar 15 04:36:16 EDT 2017 | Rob
@ Sr.Tech, Any voiding means that the part of the package under the void is not forming a solid thermal interface with the PCB, therefore it's heatsinking capability is reduced. With the drive for smaller packages with higher power handling capabil
Electronics Forum | Wed Dec 06 09:09:54 EST 2017 | davef
Suppliers have improved the utility and quality of OSP [organic solderability preservative] solderable surface protection over the years. Be cautious reading too much into older SMTnet [and web in general] conversations about handling OSP. When prop
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