Electronics Forum: area (Page 7 of 324)

Conformal Coating

Electronics Forum | Wed Nov 09 16:57:05 EST 2011 | tombstonesmt

If we were to apply a thixotropic gel into a keep out area what would the removal process be? We have keep out areas that are later used for mounting purposes so the customer requests no residue in these areas. As I previously stated, we're using mas

Voids in solder fillet

Electronics Forum | Thu Apr 17 16:41:37 EDT 2003 | davef

60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09%

Area to Diameter Conversion

Electronics Forum | Fri Jan 14 13:48:36 EST 2005 | Frank

The area of a circle = pi * radius^2 radius = squareroot(area/pi) diameter = 2*radius Is this what you were looking for?

glue dot size

Electronics Forum | Tue Dec 19 07:16:56 EST 2006 | Nuno

There is many Bond dispenser that have the Option to check the area & adjust in case of NG area . You just make the value of area & interval for check and correct . The Ones that I know is Panasonic HDF (great Output 0.07 tact time ) And Fuji GL5 ser

CSP rework station advice needed

Electronics Forum | Mon May 21 18:08:33 EDT 2007 | davef

It may not be area of activity of Winslow Automation, but they are in the Bay Area, work in an area not far afield of your need, and likely know someone that can do this type of rework for you.

Ionic contamination vs selective soldering ?

Electronics Forum | Mon Mar 17 18:37:59 EDT 2008 | aqueous

We manufacture both bulk and localized ionic contamination testers. My answer is from the perspective of the cleanliness testing method. The issue with all bulk ionic contamination testers (Ionagraph, Omegameter, Zero-Ion), is that they test the en

paste release

Electronics Forum | Sun Feb 07 10:51:09 EST 2010 | davef

The ratio of aperture opening area to aperture wall area is a critical evaluation measure for the release of the printed solder paste. The stencil thickness has the biggest impact on area ratio.

IC Solder Voiding

Electronics Forum | Thu Nov 21 21:22:15 EST 2019 | sssamw

=50% area soldered. If you need less void the the grounding area, you can increase solder paste area/volume.

double sided reflow criteria

Electronics Forum | Mon Feb 03 18:00:49 EST 2003 | slthomas

I know that the accepted (by some, although some say it may be too conservative) rule is anything less than or equal to 30 grams/square inch of surface contact area should stay on the bottom side during the second pass. How is that surface area meas

Re: fiducials

Electronics Forum | Wed Jun 09 13:11:29 EDT 1999 | John Thorup

| In past PCB designs I have cleared all traces from all layers | (except pwr/gnd) from fiducial area. It has come to my attention that this is only necessary on the side where fud is placed. Which is the correct method of design using a fidicial?


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