Electronics Forum: bare and baking (Page 7 of 20)

Solder Ball and Splash after Hand Soldering

Electronics Forum | Fri Jul 24 23:20:11 EDT 2009 | umar

Hi Dave, Thanks on your feedback, May I know the how's the contributing of Moisture content of bare board and the Thickness of the copper plating in the PTH to the solder ball and solder splash during hand soldering process ?

Solder Ball and Splash after Hand Soldering

Electronics Forum | Sat Jul 25 08:47:25 EDT 2009 | davef

Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper

Problems with Vision and White Soldermask

Electronics Forum | Tue Aug 02 12:19:48 EDT 2016 | proceng1

Actually I considered that, but I was thinking to leave the fiducial pad bare copper. These are customer supplied boards, but hopefully they will be willing to make the change for the next spin. Any tricks for getting it to see the boards we alre

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

BGA Baking & Tape and Reel Issue

Electronics Forum | Tue Sep 14 07:54:05 EDT 2004 | modwyer

Folks, At the moment I bake all BGA that are in unsealed trays, to reduce moisture etc. Is this common practice or are there particular manufacturuers that cause more problems. Also, the tape for BGA tape & reel has a hole in the tape (as is normal

Percentage of Blowholes and Pinholes can eliminate.

Electronics Forum | Thu Oct 17 05:16:44 EDT 2013 | vincentdesilva2003

Anyone can help me how many percentage of blowholes and pinholes if i do the followings: 1. Increase copper plating thickness more than 25 microns. 2. Pre Baking of PCB to remove gassing by drying out the PCB's

OSP and getting full pad wetting??

Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef

Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef

Multitroniks, Quad System and Tyco Info

Electronics Forum | Mon Aug 06 09:31:50 EDT 2001 | caldon

Quad and Multitroniks have capable machines. The merge has created some issues and concerns. The biggest issue is logistics and support. Quad is at bare bare bones. I know the last Quad product manager left 4 months ago. Also, Mirae Split from Quad i

DEK 265 and FUJI Board Loader

Electronics Forum | Mon Nov 29 13:01:35 EST 2004 | bobsavenger

I have a DEK 265LT screen printer and a Fuji bare board loader. I cannot get the two machines to talk through the SMEMA cable. I have the personality card for the DEK and I have the correct cable for a FUJI machine. Is there something that I nee

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 09:43:16 EDT 2007 | lococost

wow, never heard of such a thing! Are you sure it's allways different types of material? Are you using a washer that isnt cleaned regular? I would check your product step by step, from bare PCB to finished product to find out where exactly in your

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