Electronics Forum: before (Page 7 of 504)

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 09:28:24 EDT 2001 | blnorman

You can test for solder paste tack using IPC-TM-650 method 2.4.44. This will give you an idea of the adhesive strength of your paste prior to reflow.

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto

This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Tue May 17 10:01:42 EDT 2005 | russ

I have had the same problem with this supplier, we found that one mfg. place or process used a .015" piece of FR4 as the base while others had .030" Fr4, We discontinued use of the .015" and never had a problem again.

Spray fluxing VOC free, as operation HOURS before wave solder

Electronics Forum | Thu Sep 21 10:52:43 EDT 2006 | russ

Could you not just switch to alcohol based flux? If your prob is getting the water off the board prior to hitting the wave, maybe you could install some type of convection to aid in this? Russ

Masking with hight temp non silicone tape before wave

Electronics Forum | Tue Feb 17 22:52:11 EST 2009 | davef

Hey Roland How come capton beginning with a 'K' gives an error message?

Masking with hight temp non silicone tape before wave

Electronics Forum | Wed Feb 18 12:21:42 EST 2009 | glynnhamer

HI again Dave, I was wondering what kind of problems you were experiencing with the silicone tape that led you believe that it wasn't the correct tape and question the manufacturer? Were there more failures and solder issues ? Thanks

Masking with hight temp non silicone tape before wave

Electronics Forum | Wed Feb 18 20:15:30 EST 2009 | davef

Glynn We allow no silicone in our shop, because it ruins solderability. For more look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=47025

What should you ask question before hiring contractor

Electronics Forum | Wed Feb 12 10:19:33 EST 2020 | emeto

Can you do it? How much is going to cost? How long it is going to take?

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef

We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats

To who have built a SMT factory before

Electronics Forum | Tue Apr 06 13:43:38 EDT 1999 | Walid Khalil

Dear Sirs We are about to start up a new facility for computer prepherals assembly in Egypt hence we need some advice would you please help ? 1- What is the most suitable material for floor considering Anti static precautions. I have many more questi


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