Electronics Forum | Mon Aug 10 15:15:17 EDT 2009 | indity
I have very little knowledge of pick and place machines or assembly, and was hoping someone could give me some advice of where to start looking. I do learn quickly so I am not afraid of challenges or learning through mistakes. I need to produce abou
Electronics Forum | Wed May 22 16:36:13 EDT 2002 | slthomas
What methods do you guys use for maintaining lot and/or board traceability? When I worked in med. products, we used travelers that we recorded everything on, then serialized them at the end of the build. Not as effective as up front serialization,
Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox
Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike
Electronics Forum | Sun Mar 01 14:51:55 EST 1998 | Vincenzo Longobardo
From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you ha
Electronics Forum | Wed Sep 25 13:38:35 EDT 2002 | finepitch
Yannick, If we leave the 201 issue aside; have you checked where those BGA pads are connected to? Could those be power/ground balls connected to large (difficult to heat up) planes by any chance? Erhan
Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq
All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean
Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Tue Jun 28 00:11:30 EDT 2016 | ricoloverde
Hi, new to the forum here. First Post! Ive been using a Samsung sm482 for about 2 years and recently got the heads up that we will be getting a project soon with a BGA chip. Im wondering if anyone on here uses the SM482 for BGA and if so, can offer
Electronics Forum | Thu Mar 06 11:37:17 EST 2003 | msivigny
Hello Phil, sorry for the confusion, because of our level of defect control and tracking at each process step, we did not use AOI systems at the time. We had a manual inspection station after reflow, then ICT and Functional/Final test for each produc
Electronics Forum | Wed Sep 25 06:56:16 EDT 2002 | CH
U may check your profile ramp rate. The flux may evporated and look like cold joint