Electronics Forum | Thu Aug 21 15:10:59 EDT 2003 | paulm
Such balls (=/- 0.004)size variance can occur in a single part. If I have a ball in a part that could be (according to vendor specs) 0.008 larger than another ball the only way I can insure that the smaller ball makes contact with the paste is to hav
Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver
Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol
Electronics Forum | Tue Nov 09 13:57:08 EST 1999 | Dave F
Gary: Three things to look at in preparing do your lab work: 1 Delco uses boat-loads of array devices, use your contacts there for information. 2 SMTA Journal publishes much relaibility study information. 3 "Solder Joint Reliability of Bga, Csp, Fl
Electronics Forum | Wed Feb 24 11:05:13 EST 1999 | justin medernach
| I am profiling a BGA for the first time and I am seeing temperature flucuations on the ramp and cool down from the thermocouple I have placed through the pcb and under the component. I am using a 5 zone convection oven.Any suggestions on the plobl
Electronics Forum | Thu Feb 23 17:45:18 EST 2006 | Robert Joosten - PrintTec
Before doing anything; contact http://www.ape.com and ask for Casey Schue; he will tell you and show you the real bga rework equipment; the other brands just lack the power to do the job properly; I've seen too many people already buying inefficient
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Wed Jan 06 23:49:48 EST 1999 | Chris G.
| Hey All you Einsteins out there!! | | I gotta' problem...('course you do Steve, or you wouldn't be bugging the TechNet now would you?) I had a phone call from a acquaintance of mine wanting to bring two prototype boards over to rework a BGA socket
Electronics Forum | Mon Dec 28 10:17:09 EST 1998 | Earl Moon
| Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be help
Electronics Forum | Sun Jan 25 10:39:55 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
Electronics Forum | Sun Jan 25 10:39:52 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET