Electronics Forum: bga software (Page 7 of 12)

Excess Flux in uBGA rework

Electronics Forum | Mon Sep 24 17:38:18 EDT 2001 | mparker

First question - do you have a rework station? If so, are you experiencing the same type of failures there? I have successfully used no-clean on uBGA's in the past. 6 mil solder bumps, 10 mil spacing. 88 sites. Are you reusing previously soldered uB

Siemens line computer

Electronics Forum | Wed Mar 13 09:08:40 EST 2002 | stockley

It is a little bit sad that I know this - be prepared for some confusision - this is not as simple as it might seem. Something tells me that the calculation of the tolerances for the nominal dimensions is a little inconsistent. As I recall the defa

Looking under a BGA

Electronics Forum | Sat Jan 08 11:12:49 EST 2000 | S. Evers

Hi all, Best Thing Since Sliced Bread? No doubt many of you have seen Phil Zarrow's "over-the-top" review in Circuits Assembly of the new Ersa scope, a device that allows viewing a really neat close up a side view of the component substrate interface

Re: BGA repair/rework

Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon

| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting

Re: Part Data For fuji machines

Electronics Forum | Thu Sep 07 12:52:30 EDT 2000 | Doug

Which fuji machines do you have? The new manuals are pretty easy to follow, if you have them. SMD3 machines have the SMD3 Manual 7.1E and the BGA/Connector manuals available. Contact fuji training for more details. Otherwise, if you have certain ques

Re: Solder Paste Inspection

Electronics Forum | Thu Aug 05 16:44:36 EDT 1999 | Earl Moon

| | Hello, | | I am currently looking for a solder paste height inspection system (preferably one that will go in-line). | | Can anyone reccommend any? | | Thanks | Steve | I just arrived last week and what should appear. All six lines with DEK

Stencil Printer comparison

Electronics Forum | Tue Nov 26 09:19:29 EST 2002 | pjc

MPM UltraPrint 2000 2D Inspection Times: QFP 256 pin 16Mil pitch is 7.5 seconds BGA 225 ball 20Mil pitch is 1.8 seconds Find out the DEK times for these devices. Any UP2000 of 1995 mfg. date oand on can be upgraded to the latest software. Concer

BGA rework systems

Electronics Forum | Mon Nov 25 12:57:29 EST 2002 | caldon

Maxtim- I have used APE's Sniper, airvac, Mecal's 3500, PDR, Pace, and MArtin's rework stations. APE Sniper does the Job but to much automation and not user friendly software. PDR is to much IR and no convection. Metcal's work good now with the ne

Dispensing Paste for 0201-0402 uBGA devices?

Electronics Forum | Thu Jun 24 16:14:04 EDT 2004 | buki

I used an old camalot 1818 with solder paste dispener system to do 0402 components on LTCC. It worked very well, but there are tricks that you have to learn. Volume and placement of the dots is critical. I am sure the latest dispense equipment have s

Mydata TP9-2 and TP11-UFP difference

Electronics Forum | Thu Jul 18 17:41:31 EDT 2019 | rgduval

The UFP was a designation for "ultra-fine-pitch"; but, for the most part, you should be able to get the same placements out of both machines. Anything 0402 or above can be mechanically centered. The UFP machine will lean on optical centering for .5


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