Electronics Forum | Thu Jun 01 21:54:00 EDT 2000 | Dave F
Jeremy: Standards: � A-600 talks about percentage of solder mask loss allowed, according to the location (eg, laminate, bare copper, gold or nickel, melting metals) and equipment class. � A-610 talks to "Solder Resist Coating - Voids & Blisters" by
Electronics Forum | Sun Jan 23 03:07:16 EST 2000 | Robert Steltman
We are experiencing 2%+ dropout on one particular SOT23 device. This seems to occur during the actual pickup phase. I have made sure that my pickup position and height are correct. If I single step through the forward feed of the component, viewing i
Electronics Forum | Sun Oct 10 18:53:04 EDT 1999 | Dreamsniper
| | | | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | | | | | PCB is FR4 | | | | Solder Mask is LPI | | | | Reflow and W/S Profile =
Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe
Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed
Electronics Forum | Thu Oct 27 11:45:06 EDT 2005 | Jeffm
I have a multi layer (8) PWB with blind vias going from 1 to 7 that is experiencing occasional blistering (delam). It is only on perhaps 15% of the boards run. We vacuum baked (85C, not sure what pressure) a sample lot and still had a few exhibit the
Electronics Forum | Wed Jun 14 01:24:14 EDT 2006 | AR
Thanks ;) We even did some product development on that one. We took a normal bar of wave soldering alloy, sawed a suitable length off it and drilled a carefully measured hole through the bit of solder. The hole is wide enough so that the blister tap
Electronics Forum | Fri Jul 28 09:40:11 EDT 2006 | pavel_murtishev
Good afternoon, 1. Yes, most of all I suspect the components. Could you explain what does mean "reflothermal recipe"? Ramp-to-spike? Ramp-soak-spike? Something special? Thanks. 2. Void is really huge. This voiding differs from "standard" voiding ef
Electronics Forum | Sat Jul 29 09:01:08 EDT 2006 | davef
Well, a "reflothermal recipe" is a typo. It should read "reflow thermal recipe". Sorry for the confusion. Most people call this THE PROFILE. We think a profile is the output of a profiler when it portrays the result of a reflow recipe. We're gue
Electronics Forum | Wed Feb 21 08:06:23 EST 2007 | davef
The cause could be a lot of different things. As long as you didn't use excessive reflow temperatures, we'd guess that: * Solder mask blister: Your board fabricator should be able to demonstrate through TMA [or equivalent] analysis that the mask wa
Electronics Forum | Mon Feb 23 05:37:23 EST 2009 | emmanueldavid
Necoleta, PWB Blistering/De-lamination may not be due for Titanium finished threads / holders which is typically being used to draw high Shelf Life of Pallets and even flow across Auto Wave Soldering rails. There is also nothing to suspect on Liquid
