Electronics Forum | Mon Dec 23 17:20:05 EST 2002 | davef
Try: * Prebake * Flux density * Conveyor speed * Upper preheat * Cooling time * Chip wave * Solder temperature You could add immersion depth (1/3 to 2/3 of the board) to convince yourself that it has the least impact of any variable in wave solderin
Electronics Forum | Fri Jun 17 13:51:21 EDT 2011 | mosborne1
Your problem is at your board house with the finish. There is not enough tin deposited on the ground plane. Could be the current density too low on the ground plane. If electroless they just didn't process these correctly. What is the finish suppose
Electronics Forum | Fri Jun 24 07:32:53 EDT 2016 | davef
Tell us more ... Have you checked the density of your flux? How old is the flux? Is this a spray or a foam fluxer? What type of maintenance is being done? Do you get good hole fill with the the tank pressure of 130 on other boards?
Electronics Forum | Fri Oct 08 10:08:48 EDT 1999 | Glenn Robertson
| | | | I have a board, 4 spacers needed to be soldered on the board | | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first,
Electronics Forum | Sat Jan 06 21:56:54 EST 2001 | Greenman
While solder paste height is one possible process indicator, the other guys are right on the money - volume is key. One way to study overall paste volume is to measure every single pad, using a 3D laser analysis (see you next week for board 2)... OR
Electronics Forum | Mon Sep 21 08:14:14 EDT 1998 | Steve Gregory
| Hello: | I would like to know what causes tombstombing and how can it be prevented? | Thx. | Nichol Hi Nichol! A tombstone happens when solder doesn't wet equally on both terminations during reflow...now why that happens can be found by looking at
Electronics Forum | Mon Mar 02 23:08:50 EST 1998 | Scott McKee
| | Can anyone advise a good starting point for a temp profile for | | on 0.05" and 1206 component boards? These boards are simple | | by todays standards and do not contain any fine pitch or | | other special components. | | Thanks in advance... |
Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev
Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep
Electronics Forum | Wed Dec 23 11:11:07 EST 1998 | john watt
| | I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it d
Electronics Forum | Mon Mar 02 09:45:08 EST 1998 | Justin Medernach
| Can anyone advise a good starting point for a temp profile for | on 0.05" and 1206 component boards? These boards are simple | by todays standards and do not contain any fine pitch or | other special components. | Thanks in advance... | MM Mike,
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