Electronics Forum | Thu Nov 29 13:26:57 EST 2007 | realchunks
Nope, my thought process ejected from my brain and will have to watch this thread pan out from the side lines. Should be interesting.
Electronics Forum | Thu Nov 29 22:31:27 EST 2007 | shy
Hi Stephen, The component falling off is the component that had glue. the component witout glue is being covered by masking during wave. What is the meaning by populated the part and cure it? is it run with solder paste profile or glue profile or yo
Electronics Forum | Fri Nov 23 16:09:01 EST 2007 | davef
We're not real clear about what you're trying to discuss, because most capacitors are packaged in epoxy with a solderable termination on each end. But lets throw a couple of ideas at the wall and see what sticks. If this epoxy is: * From the capaci
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Fri Apr 10 20:35:59 EDT 1998 | Steve Gregory
| | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. T
Electronics Forum | Mon Apr 13 08:42:32 EDT 1998 | Bob Silveri
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Thu Mar 15 15:36:39 EST 2001 | traviss
Don�t be afraid of the more standard doubles sided mixed process. Even without a chip wave it works, don�t get me wrong it works better with the chip wave, but even without chances are you will be spending more on the additional steps than you would
Electronics Forum | Tue Dec 04 10:30:16 EST 2007 | slthomas
Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in reflow? A: Yes, but somebody here don't agree with me that the glued part need help from wave to get the good wetting. They are wrong
Electronics Forum | Tue Oct 03 13:08:39 EDT 2006 | Moby
This is an issue that we are seeing a lot! It used to be that the primary-side (component-side...top-side) had most of the active components. It was simple: reflow bottom first. Now, we are seeing both sides of the assembly having the same amount of
Electronics Forum | Wed Apr 15 15:04:18 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
