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IPC and ITI to Host 2023 Virtual Conference on Critical and Emerging Environmental Product Requirements

Industry News | 2023-05-15 17:43:46.0

IPC and the Information Technology Industry Council (ITI) will host a virtual conference, "Critical and Emerging Environmental Product Requirements" on June 6 from 11:00 am to 3:30 pm EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.

Association Connecting Electronics Industries (IPC)

IPC and ITI to Host Conference on Critical and Emerging Environmental Product Requirements

Industry News | 2021-05-21 04:19:46.0

IPC and the Information Technology Industry Council (ITI) will host a virtual conference, "Critical and Emerging Environmental Product Requirements" on June 29 from 11:00 am to 3:30 pm EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.

Association Connecting Electronics Industries (IPC)

IPC and ITI to Host Virtual Conference on Critical and Emerging Environmental Product Requirements

Industry News | 2022-05-18 12:35:26.0

IPC and the Information Technology Industry Council (ITI) will host a virtual conference, "Critical and Emerging Environmental Product Requirements" on June 7 from 11:00 am to 3:30 pm EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.

Association Connecting Electronics Industries (IPC)

IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

Industry News | 2023-05-15 17:38:25.0

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.

Association Connecting Electronics Industries (IPC)

SMTA and CALCE Announce New LED Assembly, Reliability, and Test Symposium

Industry News | 2015-03-03 21:14:08.0

The SMTA and CALCE are pleased to announce the new LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 17 - 19, 2015 at the Crowne Plaza Midtown in Atlanta, GA.

Surface Mount Technology Association (SMTA)

SMTA and CALCE Seeking Abstracts for 2nd Annual LED Assembly, Reliability, and Test Symposium

Industry News | 2016-04-12 15:29:42.0

The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 29 - December 1, 2016 at the Crowne Plaza Midtown in Atlanta, GA.

Surface Mount Technology Association (SMTA)

SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium

Industry News | 2017-05-30 19:40:07.0

The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 28 - November 30, 2017 at the Archie K. Davis Conference Center in Research Triangle Park, NC.

Surface Mount Technology Association (SMTA)

IPC Seeks Papers, Course Proposals and Exhibitors for Inaugural Electronic System Technologies Conference and Exhibition

Industry News | 2012-09-26 15:57:01.0

l IPC Electronic System Technologies Conference (ESTC) will take place May 20–23, 2013, with an accompanying exhibition on May 21–22 at the New Tropicana Hotel in Las Vegas.

Association Connecting Electronics Industries (IPC)

Colonial Assembly and Design, LLC Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

Industry News | 2017-01-17 15:46:08.0

IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML), meeting Class 3 requirements, to Colonial Assembly and Design, LLC, a wholly owned subsidiary of Zentech Manufacturing. Following an initial audit by IPC, Colonial Assembly and Design, LLC joins Zentech as one of the less than ten U.S. trusted sources and suppliers meeting the stringent requirements of the Qualified Manufacturing Listing based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.

Association Connecting Electronics Industries (IPC)

IPC and High Density Package Users Group Sign MoU, Strengthening Collaboration and Value to Membership

Industry News | 2020-06-24 15:45:07.0

IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.

Association Connecting Electronics Industries (IPC)


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