Electronics Forum: c-5 (Page 7 of 9)

Six Sigma Training

Electronics Forum | Thu Aug 02 12:47:15 EDT 2012 | deanm

Even though I cannot answer your question about a good Six Sigma training course, our company has had training in lean which I felt was helpful. You stated that one of your goals was to reduce cost/waste. That goal seems to lend better to a lean ma

Re: Baking Components ?

Electronics Forum | Fri Jul 30 17:22:48 EDT 1999 | Dave F

| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so

Re: Void in solder bump

Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.

| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard

RoHS parts - leaded solder

Electronics Forum | Tue Oct 25 15:19:15 EDT 2005 | jimmyjames

Sorry this is such a long thread but I would like as much input as possible to everything I ramble on about... :) ------------------------------------------------------ We are now seeing more and more RoHS parts showing up in our SMT inventory and

Screen Printing with a Pallet.

Electronics Forum | Thu Jul 12 21:41:35 EDT 2001 | mugen

A) Questions: 1) What sort of pallet materials used? 2) what PCB thickness & LxW size? 3) what stencil type & thickness used? 4) what profile type used (peak deg-C)? 5) any peak Deg-C contraints for the components SMT onto the PCB? B) We use pallet

SMT Production Capability

Electronics Forum | Wed Jan 28 19:32:26 EST 2004 | Bobby

Joe, You would be best off going with a larger company such as Universal or Mydata at this point. The market is still bad and this is where you will get your best deals. They offer better support than a small company. Small companies like Contact sys

Non-wettig on chip cap.

Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny

Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta

PCB Thermal shock

Electronics Forum | Mon Nov 05 20:34:03 EST 2001 | davef

What�s the problem? There area many heat related failure mechanisms in bare boards. You can damage boards with heat several ways. A couple favorites [Don�t try this at home. Perform on a closed track by professional solders only.] are: * Put a

Black pad analisys

Electronics Forum | Fri Nov 08 08:52:54 EST 2002 | dphilbrick

Juan There are many things that cause this and the first thing I would do is request quality records from your board fab facility on that particular lot. If they are unwilling to give them to you this is a good sign they had a processing problem. Th

What to buy

Electronics Forum | Mon Mar 12 14:19:16 EDT 2007 | Grant

no offense Grant--I was designing P & P equipment and vehemently studying > competition when your mother was still wiping your nose...I was just ? >responding to the previous comment about footprint and feeder capacity--for > which there is no equal


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