Electronics Forum | Sat May 12 08:58:23 EDT 2012 | davef
On mixing paste: There could be a lot of hand wringing about the need to minimize solvent evaporation, flux separation, and chemical activity. [True alarmists will throw in oxidation of the alloy.] But I think the real concern is a change in viscosit
Electronics Forum | Tue May 03 10:57:22 EDT 2005 | Frank R.
We received about 5K assembly boards from china. They left flux residu on top of the board and the flux they use was different than us. RESULT ... we use a translucent cylicon to cover the board and it was not possible to dry the cylicon because of
Electronics Forum | Thu Dec 23 02:56:14 EST 2004 | Steve Stach
Are you aware of Austin American Technology's "Mega" process. It combines MegaSolv chemistry with the Mega II cleaning system. MegaSolv is a single non-aqueous solvent which is deionized by the Mega thru a special solvent compatible mixed bed on-bo
Electronics Forum | Thu Jun 09 03:16:06 EDT 2005 | PSGill
I'm using Kester R520A Lead free solder paste. The flux % stated on the Certificate of Analysis(COA) when the product delivered to us is 10 %. The tolerance is 1%. But when i send the jar to an external lab to determine the flux % it is more than 11%
Electronics Forum | Thu Oct 10 21:41:38 EDT 2002 | surachai
No need to change solder pot ,anyway the contamination during clean and no clean flux may happen when change from clean to no clean which it will float on the surface of solder pot , you only clean it ( same as the dross removal ) due to in the norm
Electronics Forum | Sat Aug 02 08:12:05 EDT 2003 | davef
Q: So, can I concluded that this greenish "fungus" looking staff is not initiated from high hot air temperature setting ? A: Your temperature setting could have increased the growth rate of this crunchy looking stuff, but we wouldn't start there to
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Thu Apr 22 18:07:38 EDT 1999 | Tom B.
| On various PCB's after building processes,such as reflow, flowsolder and wash. The soldermask on the PCB's have become discoloured, like a 'marble' effect all along the solder side of the board, it is lighter in contrast than normal, although when
Electronics Forum | Wed Aug 26 10:48:30 EDT 2009 | grahamcooper22
Some print expiry date on reels and some specify a shelf life on data sheets. Two main reasons are that the flux in the wire is a mix of chemicals and over time in storage these can react so soldering performance can be changed. Although I have to sa
Electronics Forum | Thu Nov 10 10:45:32 EST 2011 | aqueous
The use of IPA in automated defluxing systems is nearly extinct for the following reasons: 1. IPA is flammable. In a spray-in-air environment, the already low flashpoint is even lower. 2. IPA is not a great solvent. There are specific containme
