Electronics Forum | Tue Jan 31 15:51:04 EST 2006 | russ
Relays huh? I can tell you from previous experience that relays are not a good heat gun candidate. Did you check how long this part can withstand the 240? I do not know what the 4 setting is on a liester but it is probably well in excess of the 24
Electronics Forum | Tue Jan 31 14:30:38 EST 2006 | Chunks
There is none, since we don't know your part or temp being used. A heat gun CAN be used to remove parts with no damage, if its controled. You need to look up your part on the manufacturers web site, find the process data (time/temp)the part is desi
Electronics Forum | Tue Jan 31 14:58:15 EST 2006 | samir
You see? Chunks, here has the right idea! To the original poster, you need to show this post to your "Desk Jockey" Process Engineer. That's the problem with some Engineers today. They forget everything they learned in Engineering school, they get
Electronics Forum | Tue Jan 31 15:40:44 EST 2006 | mgdrouin1
Comp is relay. I've pulled the spec. Max 240. Using Leister h/g with manual temp settings from 1-6 (20 - 600C)set by the operator. Gun was set to setting 4. They are using the heat gun to reflow the solder after SMT but before wave. High fai
Electronics Forum | Wed Feb 01 22:27:16 EST 2006 | KEN
Many relays use soldered post coil terminatins inside the relay. In one case many years ago I found the SMT relay manufacturer used eutectic solder inside their hermetic relay. The SMT relay would fail because the solder balled up on the post, woul
Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks
OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a
Electronics Forum | Wed Aug 25 15:47:25 EDT 1999 | JohnW
| | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | Most common reason is uneven hea
Electronics Forum | Wed Aug 25 16:42:32 EDT 1999 | Dave
| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is
Electronics Forum | Wed Aug 25 21:44:03 EDT 1999 | Jason Tomlinson
| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is
Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef
There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p
