Industry News | 2021-08-19 05:31:34.0
A rotary encoder converts the angular position or motion of a shaft or axle to analog or digital output signals, so it is also called a shaft encoder. Absolute encoder and incremental encoder are the two main types. Rotary encoders are applied widely, including situations which require monitoring or control, and mechanical systems. So how to use a rotary encoder?
Industry News | 2021-08-30 03:43:34.0
A rotary encoder converts the angular position or motion of a shaft or axle to analog or digital output signals, so it is also called a shaft encoder. Absolute encoder and incremental encoder are the two main types. Rotary encoders are applied widely, including situations which require monitoring or control, and mechanical systems. So how to use a rotary encoder?
Career Center | TULSA, Oklahoma USA | Engineering,Production,Purchasing,Research and Development
This opportunity is with a global industry leader designing and manufacturing sophisticated electronic assemblies and sub-assemblies. These products play a very significant role throughout the world providing essential equipment and components to the
http://www.flason-smt.com/product/Juki-KE-series-odd-shaped-abnormal-Nozzle.html Juki KE series odd shaped abnormal Nozzle Juki KE series Nozzle Juki odd shaped abnormal Nozzle Juki SMT Nozzle SMT Nozzle JUKI Nozzle Juki KE series odd shaped
Industry News | 2021-01-05 10:40:44.0
Automotive Grade Aluminum Electrolytic Capacitors Increase Design Flexibility and Save Board Space in High Temp Applications
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Industry News | 2021-12-22 09:30:32.0
YINCAE is excited to announce that we have developed and upgraded SMT 88UL to SMT 88UL2, a fully flux residue compatible, room temperature fast flow and easily reworkable underfill.
Industry News | 2018-05-18 15:47:55.0
As chips and packages become more complex, and installed in harsher conditions such as automobiles, the thermal conductivity of underfill materials becomes a greater concern. What can be done to prevent decreased reliability due to thermal dissipation issues?
Industry News | 2001-02-25 11:21:57.0
Kermit Aguayo, a leading industry consultant with considerable experience in Ball Grid Arrays, SMT and TH processes, as well as root cause failure analysis, has joined Process Sciences, Inc. as Senior Consultant. In his new affiliation with the company, Mr. Aguayo will bring the benefit of his experience to assisting Process Sciences' customers with process and electronics manufacturing issues.
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
