Electronics Forum: clean and led (Page 7 of 44)

Lead Free and ICT

Electronics Forum | Tue May 09 18:00:33 EDT 2006 | russ

in all actuality, you are both right. Alpha metals does have the toughest/hardest noclean residue that I have seen. When changing to no-clean FLUX you should run different probes. So back to square one. You're both right so who's gonna win?

SAC305 and Sn100c alloys

Electronics Forum | Thu Jan 29 17:04:43 EST 2009 | jeffjarmato

I run two different waves here one with SAC305 with aqueous flux the other with SN100C and No clean flux. Does anyone see any issues with running product through either machine of course after changing the Flux type? I also only use SAC305 alloy for

Tp9 and Tp9 ufp

Electronics Forum | Thu Oct 27 20:37:49 EDT 2011 | tech1

the calibration error sounds like it is an electrical verifier issue. Are you testing parts before you place them? It could be that your centering electrodes are worn or dirty, or it could be the ribbon cables from the centering unit. If you are usin

NADCAP and thermocouple calibration

Electronics Forum | Thu Aug 08 13:09:38 EDT 2013 | cyber_wolf

Hege, there is no actual calibration of the thermocouple itself. You can however verify that they read correctly. Heller sells an option on their reflow ovens specifically for this purpose. I hoping that someone chimes in here that is NADCAP certifi

NADCAP and thermocouple calibration

Electronics Forum | Thu Aug 08 19:20:08 EDT 2013 | hegemon

I too am hoping a NADCAP guy might jump in here. I would like to know how this portion of the question is handled. Evidence of PM, periodic cleaning of EQ and tools, no issues. Thermocouple calibration? You would think that evidence of Oven CAL

Thanks chartrain and Doug

Electronics Forum | Thu Nov 04 19:51:28 EST 1999 | John

Thanks folks. The current vendor is doing an alcohol wash, top and bottom, then performing an ionic test on 100 boards. I'm not to confident in the testing because the readings for a "clean" board are 25 ugm/sq in and a "dirty" board are 40 ugm/sq in

0201 and uBGA

Electronics Forum | Wed Sep 25 10:56:27 EDT 2002 | xrayhipp

Yeah, perhaps lean more towards a ramp-to-spike profile - reducing the soak time and add a littel heat to your temp above liquid. This has worked for us with water soluable paste as we are not required to use no-clean and utilizing a 6-zone oven. G

Immersion gold and BGAs

Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ

The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c

RoHS and stencils

Electronics Forum | Fri Mar 03 11:56:51 EST 2006 | Brad

We have a customer that is transitioning to RoHS compliant assemblies. Their layouts are not changing from the old boards to the compliant ones so the stencils will remain unchanged. They are going through a transition phase where both will be buil

No Clean and Underfill

Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef

Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.


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