Electronics Forum | Mon Oct 26 14:56:07 EST 1998 | carl m
| | Hi, | | Am looking out for companies which would perform the "highly accelerated stress testing" for my PCB test assembly samples. does anybody have any info regarding this. | | thanks, | | subhash | | | Most independent PCB test labs, often do
Electronics Forum | Wed Jun 06 09:28:35 EDT 2007 | larryp
Thanks for the help but I do have another question. First I guess that just the touching of the smock to the skin is anough to give the charge on the person a path to the smock. OK I can accept that if button up at the breast and sleeves. Now I kno
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Fri Oct 23 20:05:16 EDT 1998 | subhash P.
Hi, Am looking out for companies which would perform the "highly accelerated stress testing" for my PCB test assembly samples. does anybody have any info regarding this. thanks, subhash
Electronics Forum | Fri Feb 14 11:45:11 EST 2003 | SV
I was wondering if you guys had any experience with a distributed coverage Test and inspection strategy (Awaretest Xi) and could point me to technical studies in the field. thanks
Electronics Forum | Mon Mar 17 03:50:12 EDT 2008 | Sean
Hi All, Besides the above question, I have another one as below: (1) How frequent that we need to perform strain gauge study on ICT, Functional test fixture? Is it a necessary to perform this study each time after ICT, Funtional test fixture preve
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Wed Jan 26 01:39:12 EST 2005 | sohct
Is there a procedure for the this test? If yes please forward to me. Thx.
Electronics Forum | Fri Mar 19 12:17:15 EDT 2010 | stepheniii
Be carefull if you go to no clean. Or be prepared from complaints from the test department regarding their ICT pins getting dirty.
Electronics Forum | Wed Nov 17 20:11:29 EST 2021 | dwl
is there flux on the board? are you probing a test point or a soldered pad? is the probe hitting the right spot?
