Electronics Forum | Mon Mar 11 10:43:06 EDT 2019 | herve53
Hello, Is somebody could support me ? I would like to understand what is the chip on board process. What are process steps to produce a die in COB ?(please with technical details) (from start of the line to end of the production line, cleaning, pick
Electronics Forum | Mon Jan 29 10:26:21 EST 2001 | CAL
David- The information you ask about is what we deal with on an every day basis. We can entertain your questions off line at your convenience. The POC here at ACI you need to speak with is Mike Czajkowski (CHI-Kow-ski). He should be able to provide d
Electronics Forum | Tue Jul 31 13:55:27 EDT 2001 | mparker
Maintain DI water to 18 Meg Ohms resistivity. You can go down as low as 2 Meg ohms, in a pinch, but I would caution on what type of board you are running if trying to clean on 2 Meg ohm. Anything that is running an RF or high frequency circuit could
Electronics Forum | Fri Jul 16 13:33:31 EDT 1999 | Dale
We are converting from COB to SMT on a product line and want to optomize the PCB as far as Laminate, plating, passivation etc. This is a high temp application 150C. We are presently using BT Laminate but would like to get away from this. We are lo
Electronics Forum | Thu Sep 24 22:30:23 EDT 1998 | Hank Hsiung
Dear Friends, I am looking for more information on plasma decapsulator for failure analysis of COB and BGA. So far I know only one manufacturer-Nippon Scientific who produce this machine. Have any of you used their machine? What is your opinion on
Electronics Forum | Mon Mar 09 15:53:05 EST 1998 | Tom Foley
| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. Take a close look at the Philips ACM. The ACM is engineere
Electronics Forum | Wed Oct 02 12:06:59 EDT 2002 | dragonslayr
Scott - all sounds good. My primary concern is the residual flux left behind under the BGA. Will moisture entrapment become a concern over time? I believe that may be dependent on the flux formulation. I know that some no clean fluxes actually become
Electronics Forum | Tue Feb 08 20:23:10 EST 2005 | davef
Try: *Promex Industries; 3075 Oakmead Village Dr, Santa Clara, CA 95051; 408-496-0222 Fax 408-496-0117 http://www.promex-ind.com * Advanced Microelectronics, Inc.; 1 Chestnut St. Nashua, NH 03060; 603-595-0333 Fax 603-595-5410 http://ourworld-top.c
Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef
Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the
Electronics Forum | Wed May 18 08:18:55 EDT 2005 | kvanzill
Yes we have purchased a second machine due to low through put so he will be here on the 6th of June....I will be involved with training then, but so far I have not seen great support from this company as far as thier own knowledge of some problems th
