Electronics Forum: comparative (Page 7 of 153)

SMD Via hole design-thermal performance

Electronics Forum | Fri Oct 03 05:59:20 EDT 2014 | cmchoue

Does anyone well know in "via hole design in ground pad" I have few question that i want to know the answer,thanks. 1.Thermal performance compare about a.Via Full Stuff (top/bottom:solder mask and inside is air) b.Via Half Stuff (bottom:solder mask

Assembleon / Philips

Electronics Forum | Sun Feb 21 09:02:38 EST 2016 | alexeis

Hi, We have developed solution, called QPlan, that is reading CAD (different formats), merging it with BOM (including check of BOM and compare exceptions), comparing with your history library of Assembleon/Philips, simulating SMT process with automa

Seeking CAD2CAD software for creating VIOS TXT FILES

Electronics Forum | Sat Mar 25 16:57:30 EDT 2017 | zippi

Hi, Our Company write a new software to Convert p&p files to assembleon text or xml file. We use it with an Ellipse 2, topaz X and an OPAL XII. You can check all positions compare with Gerber, set database number and compare component size, set fidu

Testing new desiccant technology and comparing to Silica beads.

Electronics Forum | Wed Aug 12 18:26:16 EDT 2020 | SMTA-64387117

Looking for engineers to test new desiccant technology and compare with Silica Beads. Samples provided. Additionally, engineer can work with and collaborate with "engineers only" group lead by US Military engineer for packaging. The goal is to d

Differences between solder paste alloy SAC305 and SAC405.

Electronics Forum | Wed Sep 29 19:47:44 EDT 2021 | emeto

"For the lead free soldering of electronic assemblies, the inclusion of silver in the alloy results in better wetting compared to non-silver containing alloys and also allows for a broader process window. Silver also improves joint reliab

Re: Pallet For PCB

Electronics Forum | Wed Mar 08 12:50:21 EST 2000 | Scott K

For the Transition Automation pallets that Chris mentioned, they can be contacted at www.boardlok.com, or 1-800-648-3338. "SMT pallets", as compared to those specific to just wave solder, are becoming increasingly popular. Good Luck

Re: BGA Sphere Reflow

Electronics Forum | Thu Mar 02 21:51:46 EST 2000 | Dave F

Robert: Consider requesting samples of different sized solder balls from a variety of suppliers, solder them to dummy boards, and compare the size of reflowed balls to your spec. Then you could buy based on results. My2� Dave F

Solder Paste Height

Electronics Forum | Fri Jan 05 19:47:08 EST 2001 | slowe

Hey everyone, Does anyone out there use a solder paste height measuring system ? I would like to know what the standard is for paste height compared to stencil thickness and how you use it as a process tool. I appreciate any help. Thanks, Steve.

Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Tue Oct 03 07:48:52 EDT 2000 | steveZ

Had cheacked the archives but I didn't see much about their comparison: 1. Throughput 2. Rework Rate 3. Effect on Placement Accuracy 4. Cost (cheaper or more expensive in the long term?) Has anyone compared the above. Please help me.

Dek ProFlow Head

Electronics Forum | Thu Aug 17 09:06:26 EDT 2000 | Chad

We are currnetly looking at switching form squeegee's to the Dek ProFlow head system. Just looking for feedback on the performance compared to squeegee's. Also here the ProFlow reduces the amount of waste of solder paste. Can anyone reflect on these


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