Electronics Forum: component loss (Page 7 of 14)

Re: Double Reflow (Weight/Surface Area) Ratio Rule

Electronics Forum | Tue Apr 07 05:41:34 EDT 1998 | Bob Willis

Based on work I have been doing recently the most common reasons for component loss is board flexture and vibration on the reflow process. If parts do not reflow then weight is not an issue. There is a video on double sided reflow and PIHR from the S

Re: Simutaneous Double sided reflow assy

Electronics Forum | Thu Jul 20 17:01:26 EDT 2000 | Bob Willis

Here is some further information on SDSRS process, but please purchase a copy of the report from t he SMTA as all the money goes to charity. In the UK the SMART Group raised over �3000 for the homeless. SMTA have been raising a lot of money for the G

Re: SDRSS

Electronics Forum | Thu Jul 20 15:08:53 EDT 2000 | Bob Willis

Yes no problem here it is in a nut shell. The sponsor of my CD ROM on this process was Loctite who specifically developed a glue for the process to cure in less than 10seconds. Have a word with these guys they may even have a few CDs. PROCESS SEQUEN

Acceptable standards

Electronics Forum | Sat May 28 03:05:42 EDT 2005 | ajaydoshi

We also face same problem . It is difficult to make understand pruchase & store department. They order exact qty & issue also exact qty , later stage we have to take as process loss. They always worry about small cost but never calculte production

Re: patches

Electronics Forum | Fri Nov 12 10:36:33 EST 1999 | Dave F

Wolfgang: Sure, stacking chip components is common practice in prototyping, as you say, but it's not good practice for production work. Documentation: * ANSI-IPC-275 does not allow stacking * MIL-STD-2000A does not allow stacking * J-STD-001B is u

soldering to thick gold plating

Electronics Forum | Tue Jul 11 20:13:05 EDT 2006 | davef

We agree with Chunks. You need to turn-up the heat [slow the conveyor] because you have significantly changed the melting point of the solder alloy by adding so much gold. Relative to ENIG you should expect: * Similarly smooth surface, possibly a l

Agilis Feeders

Electronics Forum | Wed Apr 23 10:27:32 EDT 2003 | bernard

Hi Pete, What you are describing is something that will happen regardless of feeder type or machine type. When taking off a partial reel there is the potiential to lose components. It is minimised by careful handling. Yes I would agree that the Myda

Having issues placing 0603 components on my used Juki 740...

Electronics Forum | Sun Jul 10 15:29:56 EDT 2016 | bradholland

hi everyone, new user and noob here. I've spent the last week getting acquainted with my juki 740, being totally new to placement etc it's been fun to learn! I've now gotten to a stage where everything is setup in the machine for my board and is p

Very fishy missing solder paste issue

Electronics Forum | Thu Jul 21 02:45:51 EDT 2005 | Base

Probably very far-fetched, but I can think of a scenario like this: - machine picks up a component - between vision and placement the part is lost, but the loss is not detected due to oversize tool, which causes the amount of vacuum drop to go unnot

Solder Shorts Under SMT Resistors/Capacitors

Electronics Forum | Tue Sep 21 08:43:28 EDT 1999 | Christopher Cross

We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the boar


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