This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
Industry Directory | Standards Setting / Certification / Training Provider
The JPL is the lead U.S. center for robotic exploration of the solar system, and conducts major programs in space-based Earth sciences and astronomy.
New Equipment | Board Handling - Storage
DuraStat ESD is a reusable conductive fluted plastic, stackable tote design that maximizes space and minimizes weight. This new design reduces the need for riveting and sonic welding. This produces a stronger, more esthetically appealing tote. Much l
Project Description | Parameters 16 Layer Thickness: 3.8+/-0.03 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Material: SY ST115 Thermal Conductive:1.5W/m.k Back drilling, laser drilling | Application Electronic Power
Industry Directory | Manufacturer / Other
TTi makes standard and custom thermal platforms, Hybrid Benchtop Temperature Chambers which combine the benefits of a small benchtop chamber with a separately controlled thermal platform for speed, uniformity versatility.
New Equipment | Board Handling - Storage
Highly Reusable Stackable Eliminates Bags Durable Option: Partitions or Inserts DuraStat ESD Tray is a reusable conductive 4mm, fluted plastic, stackable tote design that maximizes space and minimizes weight. The tray includes a dissipative c
Technical Library | 2020-10-14 14:18:13.0
Thermally conductive adhesives provide many advantages over traditional mechanical fastening techniques. Specifically, they use less material and space and are more amenable to automation than existing solutions. The thermal and mechanical properties of these materials are well understood but little work has been done to characterize and understand their toughness and fracture behavior. This paper presents the effects of filler loading as well as matrix composition on the fracture toughness of thermally conductive silicone adhesives. It was observed that the fracture toughness of these materials increased significantly with initial filler loading, and that the mechanical properties and fracture toughness depended on the molecular architecture of the matrix used.
Industry Directory | Manufacturer
Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
Technical Library | 2020-07-15 18:29:34.0
In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment.
