Electronics Forum: contamination on immersion gold (Page 7 of 11)

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 11:56:04 EST 2000 | Dave Pearcy

We are experiencing the same problem. We just spent $1,200 to figure out that the "black stuff" is a Nickel Oxide. I am going to look into the profile end of this problem. Any suggestions would be very helpful. Dave

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 11:56:04 EST 2000 | Dave Pearcy

We are experiencing the same problem. We just spent $1,200 to figure out that the "black stuff" is a Nickel Oxide. I am going to look into the profile end of this problem. Any suggestions would be very helpful. Dave

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson

Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson

Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi

Re: Solderability on Immersion Gold

Electronics Forum | Wed Mar 01 17:05:34 EST 2000 | Dave F

Glenn: I hear you, but when Steve talks about a "dark haze" and "scrap(ing) the �black stuff� off the pads" to make them solderable, but I don�t think of "black pad." I think of "black pad" as a surface coating that typically can not be removed by

Re: Solderability on Immersion Gold

Electronics Forum | Wed Mar 01 17:05:34 EST 2000 | Dave F

Glenn: I hear you, but when Steve talks about a "dark haze" and "scrap(ing) the �black stuff� off the pads" to make them solderable, but I don�t think of "black pad." I think of "black pad" as a surface coating that typically can not be removed by

Gold Surface Finish on PCB's

Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef

Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th

Re: Solderability on Immersion Gold

Electronics Forum | Wed Mar 01 17:03:56 EST 2000 | Dave F

Steve: Someone is trying to trick you. He/she is trying to be very smart, but he/she didn�t anticipate this "dark haze" coating problem. I suspect that this person is someone you speak with every day in your plant. They may be the one that came-u


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