Electronics Forum: continuous improvement (Page 7 of 11)

Re: Farewell to fellow old-timers and up-and-comers alike

Electronics Forum | Thu Feb 17 10:38:46 EST 2000 | Keith Luke

Scott, We always regret to see a dedicated user leave the fold. Over the past few months we have made many changes to the site, and we believe, improved the quality of the forum experience for our users. During our recent site upgrade we respond

Re: Farewell to fellow old-timers and up-and-comers alike

Electronics Forum | Thu Feb 17 10:38:46 EST 2000 | Keith Luke

Scott, We always regret to see a dedicated user leave the fold. Over the past few months we have made many changes to the site, and we believe, improved the quality of the forum experience for our users. During our recent site upgrade we respond

Re: Void in solder bump

Electronics Forum | Fri Jan 15 13:35:03 EST 1999 | Terry Burnette

| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat

Touch or no touch-up

Electronics Forum | Fri Feb 11 08:15:35 EST 2005 | davef

It sounds like you already know the answer. Hand soldering is much more stressful to a board than mass soldering, because: * It is more localized and there is no preheat. * It is more difficult to control. [Different connections require different h

SMT Line Utilization Rate

Electronics Forum | Sat Mar 06 23:30:59 EST 2021 | spoiltforchoice

Are we talking about this one https://www.indium.com/blog/the-return-of-patty-and-the-professor-uptime-part-2.php & https://www.indium.com/blog/the-continuation-of-the-professor-second-visit-to-acme.php posted on here not that long ago ? I run a sma

Re: Void in solder bump

Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman

| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |

Re: BGA REFLOW PROBLEMS

Electronics Forum | Mon Mar 27 20:48:25 EST 2000 | Dave F

Robert: Howya doin' bud? You say "BGA Shorting!!!" I say "Too Much Solder!!!" So, earlier comments about aperture design are appropriate, make good points, and I think we both agree that improvements could be made in your stencil design, but I'm

Re: Help for CSP Prototyping

Electronics Forum | Sat Aug 21 17:10:12 EDT 1999 | K. Vikas Sharma

| | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | Anyone working on this , please help out. | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through p

Re: Help for CSP Prototyping

Electronics Forum | Sun Aug 22 08:21:39 EDT 1999 | Earl Moon

| | | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | | Anyone working on this , please help out. | | | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went t

Removal of No-Clean flux residue

Electronics Forum | Thu Sep 06 10:55:37 EDT 2001 | davef

saturation occurs at ppm levels. Remember, IPA is extremely flammable and its bulk use makes the plant liable to all sorts of quite repressive safety rules/regulations and so on. Ignoring these rules exposes the owner to fines and possible plant cl


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