Electronics Forum | Tue Aug 09 11:14:28 EDT 2016 | cyber_wolf
•Rated Speed of 40,000 CPH •140 - 8mm Device Locations •14" x 18" Max PCB Size PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm Board Thickness: 0.3 to 4.0mm Component capacity Up to 140 types (8mm tape) Placing rate 0.09 sec./component - 40,
Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan
Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref
Electronics Forum | Tue Dec 10 14:10:38 EST 2002 | Randy Villeneuve
Steve, I wave solder most if not all our boards with selective wave pallets. I did not catch if the solder balls were on top of the board or on the bottom but that will make a difference on what to do to get rid of them. Pallets are good and bad. On
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef
Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we
Electronics Forum | Wed Feb 24 14:52:43 EST 2021 | spoiltforchoice
Well to their credit Neoden has regional representation in the EU, Aus and USA which helps support the end user better than email/QQ chats to China, although how much they really can do on their own is not something I could speak for. I suppose for
Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas
IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D
Electronics Forum | Sat Oct 29 21:24:30 EDT 2005 | Paul Standeven
The CSM84 family units are 3 headed pick & place machines with mechanical chuck centering technology. They use a beam pointer for fiducial correction. The CSM84V is the same as the CSM84 but has a downward looking fiducial camera onboard in lieu of
Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders
Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.
Electronics Forum | Fri Oct 13 13:44:03 EDT 2000 | Mike McMonagle
You can achieve a wide range of dot heights when stencil printing by using a polyimide stencil along with a .040 snapoff. Loctite has a system for this that they call Varidot, by varying the size of the apertures in combination with the .040 snapoff
