Electronics Forum | Tue Mar 04 08:56:38 EST 2008 | tonyamenson
I talked to a solder paste chemsist and found out a few things. From above (Dave F) states a test for solder paste involving reflow on a non-wettable surface. Commonly known as the solder ball test this test is performed all the time by paste manufa
Electronics Forum | Tue Jul 25 16:08:52 EDT 2017 | dontfeedphils
I'm currently working on bringing a manual coating process/workcenter online and my QA team is giving me some grief. For background, we're using Humiseal 1B31 thinned with thinner 521, mixed at 1:1 by volume. Spraying through a Binks HVLP with 10 P
Electronics Forum | Sat Jan 14 09:46:41 EST 2023 | symakhan
Hey Guys As an architect, I'm pioneering a house project and have already created all the blueprints. Now it's time to construct! Even though I understand the fundamentals of electrical engineering, there are certainly more intricate components that
Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef
Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l
Electronics Forum | Mon Jun 11 22:06:00 EDT 2001 | davef
The issue is not the cleanliness of your in-bound water. The issue is the cleanliness of the board your customer receives. Look at J-STD-001C, Para 8, "Cleanliness Requirements". The end product cleanliness is the end result of your: * In-bound
Electronics Forum | Tue Jun 12 18:06:17 EDT 2001 | davef
The criterion you use will depend on the test method you select. For minimum requirements, look at J-STD-001C, Para 8, "Cleanliness Requirements". I figure that you�d measure the residues on a lot of your current product, measure the res on a lot o
Electronics Forum | Fri Oct 30 01:07:34 EST 1998 | Earl Moon
| I am a recently graduated Process Engineer. I am working for a company developing and manufacturing printed circuit boards. I am looking for a web link, magazine article, book, etc which describes the processes which happen at a board house. More s
Electronics Forum | Wed Sep 30 18:43:46 EDT 1998 | Graham Naisbitt
Chrys, Please, refer firsatly to J-STD-001 Appendix D. Now, consider: SIR testing will help define the reliability of your finished assembly - it will not tell you how clean it is. Which do you or your customer prefer? Present SIR testing de
Electronics Forum | Tue May 26 19:20:39 EDT 1998 | Graham Naisbitt
Ryan, Please consider the following: There is no such thing as no residue flux. Low or no solids flux contain "wetting" agents to help the stuff stick upside down! Try painting your ceiling with less than 2% solids paint!! With all this excess liquid
Electronics Forum | Thu Nov 19 09:32:52 EST 1998 | Earl Moon
| | | | | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wav
