Electronics Forum | Wed Oct 21 09:16:01 EDT 1998 | ULISES PENAHERRERA
I'M LOOKING FOR A SOLVENT TO MAKE REMOVING EPOXY FROM THE BOTTOMSIDE OF BOARD ON SMT COMPONENTS. THIS IS MOST IMPORTANT AFTER THE EPOXY HAS CURED AND EVEN RAN THROUGH THE WAVE. I'M LOOKING FOR A WAY OF MAKING THE REWORK PROCESS ON THE CURED EPOXY MO
Electronics Forum | Wed Nov 14 12:11:04 EST 2001 | eabbott
We are experiencing many solder balls after wavesolder. Two different board suppliers of the same board are involved. My initial reaction was that it was the process but in researching information in this forum I am beginning to wonder. How can on
Electronics Forum | Wed Jan 29 16:14:16 EST 2003 | blnorman
One of the safest ways to dispose of urethane conformal coating waste is to cure it. Once it's cured it no longer is considered a hazardous waste. In the uncured state it is. We have tubes of epoxy adhesives (out of shelf life) that we do the same
Electronics Forum | Tue May 10 13:47:17 EDT 2005 | amejia
I currently use Chemask CM8 Peelable Masking which currently takes 30 - 60 minutes to cure. Does anyone know of another solder masking which cures in less time at room temperature. I know that curing times decrease using an oven, but that is not an
Electronics Forum | Thu Jul 19 18:03:14 EDT 2007 | dwanzek
Wait...stop! Some adhesives will void when cured... some common branks... maybe already mentioned. Heraeus PD955 will minimize voiding when curing the adhesive. Voiding can have devestating consequences....learned from experience. Another key is kee
Electronics Forum | Thu Jul 06 12:31:25 EDT 2017 | bmedeiros2017
Hello, Curious to know if anyone has had some experience converting a Heller reflow oven to Cure 1B73 Coating material. Please share experience and process parameters to help obtain cure to conformal coated boards. TIA!!!
Electronics Forum | Wed Dec 08 10:25:00 EST 1999 | John Thorup
Hi Ken Given the small mass of the dot I'm guessing that the adhesive is being flash cured by the heat of the board and the resulting semi-solid is unable to release from the nozzle like a liquid thereby causing your strings. Placing components on c
Electronics Forum | Fri Apr 17 14:12:27 EDT 1998 | Earl Moon
| Is there anybody to help me ? | We have small balls appearing on the boards soldered by | wave soldering machine and it looks that use of nitrogen | is linked to the problem (because without nitrogen, we have no more | problems). | That remind you
Electronics Forum | Wed Nov 14 20:28:24 EST 2001 | davef
Not to worry. Just run the boards through the cleaner. It will remove all the solder balls. The gross filter on your washer will collect all the solder balls. Coo eh? ;-) How to cure SM? Is your mask UV, er thermal? After learning the type, you
Electronics Forum | Mon Mar 29 14:58:08 EST 2004 | davef
Josh: Final cure of the LPI solder mask: 310*F for 45 minutes. Your board fabricator needs to do a better job. Most fabs do not check cure, because the processes subsequent to cure are so brutal that the fab expects the following process to highlig
