Electronics Forum | Wed Mar 10 04:52:11 EST 2004 | Gabriele
Hi As I know PBGA reballing is not recommended or better not allowed by all the most important Standards. Exceptionally Cstly Ceramic BGA or Ceramic ColumnGA where you can perform electrical test before reballing (90/10 ball/column-balls made) some
Electronics Forum | Tue Nov 15 12:21:20 EST 2005 | arclightzero
Well, I can't speak for them falling off later on, as that's not when I see them, and they are passing their wire pull tests after bonding. What I am seeing is electrical opens during testing, and these opens coincide with the Au/Al bonded points. Th
Electronics Forum | Wed Dec 20 04:43:36 EST 2006 | greg york
Any decent flux would volatise off with the heat of the wave unless absorbed into the solder mask. Test this by trying to clean in alcohol or common solvent aerosol, if it does not clean then it is probably Mineral Salts from solder mask fillers. Ano
Electronics Forum | Wed Nov 12 13:00:58 EST 2008 | cisridn
I have to build test fixtures for RF Power transistors. These components generate alot of heat so the PCB is soldered to a baseplate. The problem I am having is that I am getting too much solder flowing thru the via's and flooding the topside of th
Electronics Forum | Fri Jun 25 00:16:11 EDT 2010 | leadthree
I got a report from Yageo yesterday with microsections and and and..... result: Cracks I did a test run on boards after ICT, but before coating. They are all ok. Seems the cracking happens somewhere after the ICT. But at that stage all assembly is a
Electronics Forum | Thu May 26 07:50:33 EDT 2011 | scottp
What process steps have been completed before the cross-section? What type of devices have solder cracks? Are the cracks found after just normal processing or after some type of validation testing? It is very unlikely to be a heating/cooling issue
Electronics Forum | Fri Jun 07 12:44:55 EDT 2019 | gregoryyork
These residues are extremely water miscible BUT you will probably need the extraction of heated IPA/Water to get the porous resist to release the residue quicker than it would do releasing it naturally in the field. Why dont you try to soak the circu
Electronics Forum | Wed Aug 12 18:26:16 EDT 2020 | SMTA-64387117
Looking for engineers to test new desiccant technology and compare with Silica Beads. Samples provided. Additionally, engineer can work with and collaborate with "engineers only" group lead by US Military engineer for packaging. The goal is to d
Electronics Forum | Thu Aug 10 15:06:03 EDT 2023 | thecolonel97
We tried choking down the water flow to the coolers yesterday just below above the point of where we wouldn't detect flow in the system. This raised the temperature in both coolers for this test. This morning when cleaning the buildup, this had mad
Electronics Forum | Tue Jan 08 11:28:30 EST 2002 | mregalia
We use NC flux exclusively for SMT and wave soldering. And it is a fairly old formula from Multicore, though we are currently qualifying a new formula. The automated soldering does not appear to be a problem. It is only the hand soldering that causes
