Electronics Forum | Sat Feb 12 09:08:47 EST 2000 | Sal
Experiencing a problem with a 208 PBGA device. I am achieving good wetting with the exception of one ( damn) pin on the outer corner.I have a really good profile but the worrying thing is that it is so inconsistant. Once this open pin failure is dete
Electronics Forum | Mon Nov 06 12:19:25 EST 2000 | Tom Gervascio
I ma trying to get some information on possible causes and screening tests for PCB delamination. Is the main cause moisture absorption of PCB material or entrapped chemicals and or air in innerlayers that expand when expsoed to subsequent reflow and
Electronics Forum | Mon Mar 05 20:53:32 EST 2001 | davef
When you say all over the board, please give more detail. Where are they located? [All over wave soldered portion, laminate only, solder mask only, solder only, specific components only, etc] When you say white residue, what color are they really?
Electronics Forum | Mon Jun 25 09:08:22 EDT 2001 | Dave G
What type of board finish ? I've seen this same defect with QFP's on some of our HASL boards. Best I can tell either the PCB's have poor solderability or uneven pad heights due to poor solder leveling at the PCB fab. Newer PCB's seem to yield bette
Electronics Forum | Mon Apr 13 17:03:40 EDT 1998 | EFData
We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X 75
Electronics Forum | Wed Oct 17 10:37:13 EDT 2001 | davef
Help us understand your situation better: ARE THE QFP BOWED? If so, * Where are the QFP bowed? * Is the QFP body bowed or is it just the leads? * How much are the QFP bowed? * Are all QFP the same part number, from the same supplier, date code
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Thu Aug 08 17:51:51 EDT 2002 | davef
'The emailer on Cold Fusion came that way and we have been soooo busy trying to make sure the Geary's is gone before the date code comes-up that we just haven't had time for munitia like that.' Well, I'd like to revisit that decision, given: * Volum
Electronics Forum | Wed Jul 02 10:19:08 EDT 2003 | caldon
It kills me when people say "We have been doing this for 10 years and we will not change" guaranteed one day the shite will hit the fan when they have a screw up. We have ran into this before... Until/unless they are willing to work with you you wil
Electronics Forum | Tue Aug 23 16:57:29 EDT 2005 | HOSS
50% of seeing it in a single pass. The only time we do this is if we have a board off the line that has delaminated. We'll run a sample of boards through bare to confirm that we have a bad batch. Even if we see no failures on the bare boards, we'l
