Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se
| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Mon Jul 29 09:19:00 EDT 2002 | pjc
Quick Change Tooling is one advantage for DEK when comparing the MPM UP2000. DEK has Form Flex. Good system, but I've heard concerns about long term dependabilty. All support tooling options offered on the UP2000 takes a bit of time to set up. So, If
Electronics Forum | Sat Sep 23 21:52:51 EDT 2017 | jlawson
In most cases PnP files are all that is needed for SMT program generation. BUT, it depends on origin reference of this data as exported to PnP and could be off in X,Y and rotation of image pending when PnP Data is exported. Also Rotation of parts
Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F
Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �
Electronics Forum | Tue Jul 13 10:26:38 EDT 1999 | HST-SE
| | Hi, | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | Secondly, I n
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Fri Jan 28 12:18:32 EST 2005 | Chunks
Your best bet is to do a decision making matrix. Each company has so many different criteria�s it's hard to pick out which one might be important to yours. Simply pick out your top 5 paste manufactures. Next decide what your "Eliminators" are - th
Electronics Forum | Sun Oct 09 11:16:06 EDT 2016 | mekmat
Hello, I would like to ask you about the minimal distance between components and border of pcb especially V-cut to avoid crack of component during depaneling? I need some standard (IPC or something) where is this defined? Thank you for your support
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
