Electronics Forum | Thu Mar 29 15:29:11 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Mon Sep 27 04:08:25 EDT 1999 | Earl Moon
| | | I am in the process of picking a new resistor network for one of our new board. Since we are new to SMT i would like to get some opinions on networks. Currently we use one molded gullwing type network on our boards with no problems. Other than
Electronics Forum | Sat Sep 05 08:55:57 EDT 1998 | Dave F
| We are writing to have information about the automatic mounting process of flip-chip. | We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). | Thanking yo
Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef
Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c
Electronics Forum | Thu Mar 05 13:17:19 EST 1998 | Justin Medernach
| Hello everyone! | Does any know anything about bare board size variations? | Is there a spec. or tolerance? | I'm running small lots of boards and during the screen printing process | I find that I cannot paste each board perfectly.I've tried other
Electronics Forum | Wed Nov 02 14:31:55 EST 2005 | erokc
First about the forum posting, my displayed name "Dave" comes up as my logon name "erokc" on this computer, not so on another computer I use??? Author names that allow email can be selected like "Dave". Bobpan, click on "Dave" to send an e-mail. Y
Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff
| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Thu May 20 19:11:48 EDT 1999 | Earl Moon
| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | Deo
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