Electronics Forum: dipping and profile (Page 7 of 29)

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef

UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 01:10:16 EDT 2007 | Haris

My SMT line does not has these facilities so would you please tell me regarding the UNDERFILL AND FLUX-DIP process and how they can be done? Thanks.

Time and temp in lead and lead-free reflow

Electronics Forum | Tue Jul 29 10:46:17 EDT 2008 | realchunks

Oh, well if you can profile, model your profile to the profile supplied by the paste manufacturer. Anything outside of their recommended profile is all experimantal.

Machine profiling and product profiling

Electronics Forum | Thu Jan 23 16:59:14 EST 2003 | barry

what are the methods used out there to verify reflow oven performance or machine profiling. What intervals are good practice and is it necessary. We do product pofiles with our profiling equipment and can that be used to base your machine performance

Vertical Oven Profiling and profiler

Electronics Forum | Tue Nov 29 06:31:51 EST 2016 | shockwave24

Hi all, I just would like to ask if what brand and model of profiler can you recommend for profiling of a Vertical Oven?

Wave Cassettes and Heat convection

Electronics Forum | Mon Jan 15 11:41:56 EST 2007 | davef

Questions are: * Does the component take solder when you dip it in the solder pot to test the solderability of the leads? * Can you get full barrel fill when wave soldering a bare board? * Is your flux reaching the top of the board through the hole b

Wave Cassettes and Heat convection

Electronics Forum | Mon Jan 15 13:12:18 EST 2007 | realchunks

So others can solder the same board and part but you can't. Dipping the legs in flux doesn't help. Then it's either your pre-heat or wave. Measure your pre-heat and compare to others or flux mfger. Do you have chip wave or something like an Omega

Solder beads and wave soldering

Electronics Forum | Mon Jul 10 07:46:51 EDT 2006 | ronalds

You are right, RSS profile is not the correct description. I am using a profile which heats up quickly to let the flux spread. Next linear up to activate the flux and prevent thermoshock. My experience is however, that small changes in this profile

Machine profiling and product profiling

Electronics Forum | Fri Jan 24 16:57:39 EST 2003 | MA/NY DDave

Hi, I will give just one of the couple of ways I have seen. Once a particular product is debugged, verified through the process the profile of the Oven and it's settings are stored on a separate PC. Prior to running that product and at the start of

01005 components and reflow profiles

Electronics Forum | Mon Apr 16 10:01:03 EDT 2012 | patrickbruneel

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