Electronics Forum | Thu Jan 09 00:10:59 EST 2014 | lingakarthik
Hi guys, can somebody explain me why and how immersion gold is better than hard gold platting or vice versa? We are not going to do any welding operation over the Gold platted area, rather we just move a sliding contact over the gold pl
Electronics Forum | Fri Mar 24 18:07:25 EST 2006 | Chris
Flash gold is just thin gold plating over electroless nickel or electrolytic nickel. Flash gold is electrolytic gold where the panel is connected to a plating rectifier and current causes the plating process to occur. Gold thickness is controlled b
Electronics Forum | Fri May 24 14:03:19 EDT 2002 | luvtolean
I have used both immersion silver and immersion gold and found that the immersion silver performed better in reliability studies for BGA's using 63/37 paste.
Electronics Forum | Tue Oct 26 14:11:25 EDT 1999 | Dave F
Gary: Two things: 1 Reworking golding fingers is an old topic, check the SMTnet archives to get started. 2 Gold fingers should not be discoloring, unless: * You are doing something bad to them ... OR * Your supplier has doinked the process, which
Electronics Forum | Mon Feb 14 12:19:32 EST 2000 | Dave F
Dean: I associate black plague as an immersion gold process problem (although I could easily be wrong): Everybody looks at the nickel, but the cause turns out to be the immersion gold is too aggressive. The immersion gold works by corroding the nic
Electronics Forum | Mon Oct 20 13:17:05 EDT 2008 | jdumont
No pictures pre-paste. I have noticed on a few occasions a couple of boards that look like they have a slight discoloration on some areas of the board. Kind of like a shadow almost on the gold. Josh
Electronics Forum | Mon Nov 22 12:45:52 EST 2021 | proceng1
You say the resistor is blown. Is the body discolored? Is it possible that these are not the colors, like maybe the first GOLD is actually orange? Perhaps post a photo?
Electronics Forum | Thu Sep 30 10:30:11 EDT 1999 | Chris May
I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. What is the best way to achieve
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