Electronics Forum: double reflow consideration (Page 7 of 76)

Reflow profiling of double sided assemblies

Electronics Forum | Fri May 24 09:34:57 EDT 2013 | markhoch

I run the same profiles for Top and Bottomside assemblies for all of my products. Only in rare instances have I been forced to run a profile with cooler bottom zone settings. This was obviously driven by assemblies with heavier components on the bott

Adhesive printing with double side board

Electronics Forum | Tue Jul 24 10:57:12 EDT 2007 | babe7362000

Is there a reason why you want to wash the board > before wave?!?!? > > What is your process > flow? > > I run bottom side of my boards first, > then top just to make it easier to setup (easier > to put those support pins around those smaller

Reflow profiling of double sided assemblies

Electronics Forum | Thu May 23 11:57:21 EDT 2013 | dyoungquist

We run the same profile for both sides. We also run the bottom temp 10C cooler in the final 2 heat zones.

Reflow profiling of double sided assemblies

Electronics Forum | Fri May 24 14:42:35 EDT 2013 | dilogic

Google for this: "weight_limit_qfn_smta.pdf" Although it is focused on QFN, formula can be used for most parts...

Re: reflow/cure/wave for double side assembly

Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam

| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run

Adhesive printing with double side board

Electronics Forum | Tue Jul 24 10:29:10 EDT 2007 | ed_faranda

Is there a reason why you want to wash the board before wave?!?!? What is your process flow? I run bottom side of my boards first, then top just to make it easier to setup (easier to put those support pins around those smaller components). But,

Adhesive printing with double side board

Electronics Forum | Tue Jul 24 17:15:13 EDT 2007 | blnorman

Unless you've got an extremely agressive cleaner, the epoxy should hold the parts during the delay time. That's their job basically. We ran reflow first pass, glue parts, then wave solder second pass. There were potential delays between adhesive b

Re: double sided step by step

Electronics Forum | Tue Oct 05 02:47:01 EDT 1999 | Eric

| Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding so

Reflow profiling of double sided assemblies

Electronics Forum | Fri May 24 19:18:03 EDT 2013 | hegemon

The formula is a great help, where was it 20 years ago? LOL After running a few thousand different products over the years, you start to get a feel for what is going to be trouble with regards to falling off the bottomside during the secondary refl

Re: double sided step by step

Electronics Forum | Mon Oct 04 21:37:31 EDT 1999 | park kyung sam

| Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding so


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