Electronics Forum | Wed Jan 25 17:12:41 EST 2006 | adrian_nishimoto
Billy, I think the most versatile kit out there is the RB-2000 system from Mini Micro Stencil. We have not run into a part yet that we could not reball, even ones with a raised encapsulated center. They even make custom screens that match the compo
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Wed May 23 11:57:00 EDT 2012 | patrickbruneel
Since you have an alcohol based flux one more thing you can try to eliminate flux encapsulation under the connector. Is flux a board and remove when fluxed. Let the board sit for an hour to assure all solvents are evaporated and place the board in th
Electronics Forum | Mon Sep 22 23:27:09 EDT 2003 | severs
By "hacking" do you mean altering the performance of the board or something else? This reminds me of something I saw a while back. Better termed counterfeiting than hacking, it may have some relevance to what your friend is trying to do. The probl
Electronics Forum | Mon Jan 21 19:22:38 EST 2008 | davef
In your situation, the issue is the compatibility of your flux residues and the encapsulant that you choose. First, contact your encapsulant supplier for advice. They've likely been down this road with other customers and may be able so save you som
Electronics Forum | Tue Dec 08 17:55:51 EST 1998 | Dave F
1. What is the best way to remove polyurethane conformal coating from selected areas? Your conformal coat material supplier is best equipped to tell you how to remove the coating. Polyurethane conformal coating is not easy to remove. Without in-pu
Electronics Forum | Wed Jun 07 20:21:26 EDT 2000 | Dave F
Point well taken John. Expanding on epoxies: Novolac is a multifunctional epoxy ... a phenolic resin. Most phenolic resins are made using phenol (P) and formaldehyde (F). They comprise the bulk of IC packaging and are divided into two classes:
Electronics Forum | Wed Jun 07 21:07:07 EDT 2000 | Dave F
Ooooops, I messed that up!!!! It should read: Point well taken John. Expanding on epoxies: Novolac is a multifunctional epoxy ... a phenolic resin. Most phenolic resins are made using phenol (P) and formaldehyde (F). They comprise the bulk of
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Electronics Forum | Fri Jul 20 17:09:10 EDT 2001 | davef
Circuits Assembly magazine 09/99 "Defluxing with Ultrasonics" by Les Hymes. [There's more but I can't find it right now. I'll add to this as I find the junk, er very nice stuff.] J-STD-001C states that its OK to use ultrasonics for cleaning so lon
