Electronics Forum: end (Page 7 of 303)

Re: How to do with tombstoning for component '0402'

Electronics Forum | Thu Nov 02 03:42:49 EST 2000 | CHRIS MAY

Tombstoning primarily occurs due to the fact that the paste may melt and wet the metallized face of the chip earlier or better at one end than the other. This could be due to a difference in heat capacity (thermal shadowing ?) or that one end of your

ceramic cap cracking

Electronics Forum | Thu Feb 03 04:55:21 EST 2005 | Dougs

OK, component wide portion runs with the conveyor, so really both sides should heat and cool at the same rate. The crack is at the termination between end cap and ceramic body and run vertically up the end cap, so when we remove the cap it comes of

surface mount connector, disturbed solder

Electronics Forum | Mon Apr 21 10:59:39 EDT 2008 | davef

That you have 'grainy' solder only at the ends of the connector and not at all solder connections indicates that your quality types are on track and are pointing you in a direction worthy of investigation and developing a better understanding of the

queations about the production of semiconductor component, including wafer IC decrete device

Electronics Forum | Tue Dec 03 09:54:20 EST 2019 | davef

CURIOUS MINDS WANT TO KNOW Which processes are "front end" and which are "back end"? Why are they separated like that? Why are "front end" and "back end" processes usually done in separate plants? What are the high-value activities? Which activi

Cooling racks

Electronics Forum | Thu Sep 21 15:33:52 EDT 2000 | Gilbert Ramirez

We currently use process carriers to run our products. We do not have chillers at the end of the reflow ovens (no space) so you can imagine how hot the carriers come through. Are there any cooling racks out on the market that I can look into to pla

Solder balls

Electronics Forum | Wed May 02 13:59:20 EDT 2001 | kt

Can anyone tell me what they think is the main cause of excessive solder at the end of the lead after wave. These are not solder peaks as if the leads were cold. It is a well wetted ball of solder on end of the lead. Also, some times you see excessiv

White residues

Electronics Forum | Tue Apr 23 00:45:48 EDT 2002 | ianchan

would like to do a paste change, yet this paste was defined by the end-end-customer. this makes it one heck of a ECN paper trail just to start the evaluation DOE of new paste for this *customer project* group. ah, the politics of working life... wond

SMT package types

Electronics Forum | Wed Oct 30 09:37:48 EST 2002 | stepheno

One thing to take note of with the TSOP's is that is a T1 variety and a T2 variety. One has the leads on the sides, the other has leads on the ends. I believe the T1 has the leads on the ends, but I would have to look it up to be sure.

0402 opposing track balance

Electronics Forum | Thu Aug 07 01:23:43 EDT 2003 | craigj

Does anyone out there have any info on track balance ratios. i.e. heavy track entering 1 end of component (0402) and thinner track leaving other end and how this effects/causes problems like tombstoning. Am trying to put together design rules for cus

Hand tools @ work station ?

Electronics Forum | Tue May 18 09:40:46 EDT 2004 | russ

Can you have them checked in and out at the beginning and end of each shift? Any missing tools must be paid for by employee, This does make them stick around longer. Of course then you end up with "someone came by and took them" excuses. but it d


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