Electronics Forum: enig thickness (Page 7 of 12)

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 02:08:47 EST 2006 | adeline_ko

Hi, What is the different between Electroless Nickel / Immersion Gold (ENIG) and Immersion Au. Are they refer to the same finishing? We has been using the Gold thickness (0.00005 - 0.00013mm) , nicket (0.0025mm) for all Gold finishing brd (Immersio

OSP

Electronics Forum | Wed Apr 02 15:55:04 EDT 2008 | boardhouse

See if you can find someone with an XRF machine or talk to your Current Board house they probably have this equiptment if they run ENIG or Silver finishes. I would stop in with some boards your having issues with and have them measure the thickness.

Immersion Gold (ENIG)

Electronics Forum | Fri Sep 16 14:29:34 EDT 2005 | kris

look through the archives for wave soldering whats the thickness of your gold ? have you done all you can for adjusting the process ? check archives for recommendations

ENIG vs Flash Gold

Electronics Forum | Sat Mar 25 07:10:12 EST 2006 | davef

We agree with Chris. If your gold is applied properly and is the correct thickness, you will see no difference. One nit on Chris' comments: immersion gold will plate-out [self-limit] around 8 thou, although we've heard 12 thou.

ENIG vs Flash Gold

Electronics Forum | Mon Mar 27 09:54:35 EST 2006 | russ

Flash gold is usually to thick and will cause embrittlement of your solder joints if concentration exceeds I beleive 6% in the joint

ENIG

Electronics Forum | Thu Jan 22 05:29:25 EST 2009 | johanhuizing

I think IPC-4552 is define the thickness of Nickel as: 3 to 6�m and Gold as: 0,05�m minimum

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia

Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of

Immersion Ag

Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef

We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition

ENIG vs Flash Gold

Electronics Forum | Fri Mar 24 18:07:25 EST 2006 | Chris

Flash gold is just thin gold plating over electroless nickel or electrolytic nickel. Flash gold is electrolytic gold where the panel is connected to a plating rectifier and current causes the plating process to occur. Gold thickness is controlled b

soldering to thick gold plating

Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit

Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into


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