Electronics Forum | Fri Feb 25 16:15:18 EST 2022 | mikesewell
see IPC-WP-019
Electronics Forum | Thu Dec 01 14:47:25 EST 2005 | Amol Kane
Hi, I am testing some lead-free assemblies using ATC. it was suggested to me that if i do in-situ testing, then i should measure the starting resistance, and subsequent resistances values after n cycles, and when the resistance value increases by 1 o
Electronics Forum | Fri Jun 14 13:47:21 EDT 2013 | rway
Chances are this is not a component failure. First, these are passive components with passive testing on the ICT. He may have guarding issues, but more information is required as has been stated. Are all capacitors with the same P/N failing in dif
Electronics Forum | Tue Jul 29 14:25:20 EDT 2014 | kenkay
We have been struggling for a while with some through hole sealed mechanical relays that fail at test after they have been sitting a while. They will initially pass test, but seem to fail if they sit for a few days. We made sure our wave process was
Electronics Forum | Tue Mar 16 18:27:34 EST 1999 | Earl Moon
| We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of it
Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef
IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials
Electronics Forum | Thu Dec 09 17:45:27 EST 2004 | davef
You're correct. There is no criteria for no-lead, but there none for SnPb, either. Solder joint strength in pull/shear will vary with lead geometry, solder volume, lead metal/metallization, the way the test is done.
Electronics Forum | Wed Oct 17 14:52:25 EDT 2012 | rway
1) Is there something your design/pcb Engineer can do to lay the array out a little better for the wave (i.e. add substrates, board thickness)? 2)What do you mean by material movement? Single piece/continuous flow. 3) Shouldn't be too hard. You
Electronics Forum | Thu Aug 08 18:21:21 EDT 2019 | Aaron
I recently purchased a contact systems 3, and 3s, and 4 of their 3zs. they were all used in various states of working. supposedly one 3s and 3z were working when taken out of service and had sat for a few months. another 3z had a homing issues and th
Electronics Forum | Sun Jun 25 08:51:02 EDT 2006 | cloggy
Problems like these are not caused by bad feeder quality. As described in the solution finding, the pull off forces of the cover tape are just too high. Cause is the blistertape and not the a feeder. Have you ever tested if the pull of force of the
