Electronics Forum | Fri Aug 04 14:57:09 EDT 2017 | davef
What are the vias somewhat filled with? Can you explain in greater detail the effect that you observe?
Electronics Forum | Mon Aug 07 08:33:11 EDT 2017 | abruno1995
The vias are filled with the silver plating, it's excess plating and i wanted to know if there was any issues with ICP
Electronics Forum | Fri Oct 12 16:04:10 EDT 2018 | davidsmullins
75%?
Electronics Forum | Mon Apr 22 15:05:47 EDT 2002 | tim_easterling
Depending on the volume of boards you are manufacturing, the most cost effective solution would be to epoxy plug the vias prior to LPI soldermask application. The technique is common practice and most suppliers can provide it will little or no cost a
Electronics Forum | Sat Dec 14 10:10:04 EST 2002 | davef
This is a good idea. Heck, you could fill the bags with sand, if you wanted. Like anything else in the shop, bean bags require attention and maintenance. If you don't, eventually the seams on the bags loosen / break and you have to do a "clean-u
Electronics Forum | Mon Dec 16 15:12:05 EST 2002 | sueph
I made a small bean bag from 100% cotton filled with rice, to hold down small resistors that wanted to tilt over solder wave. It worked fairly well as long as I didn't try to take it off the components to soon, as sometimes they would want to stick
Electronics Forum | Thu Sep 02 22:23:44 EDT 2004 | davef
Dunno about something formal. After you specify your hole size and fill material, why not say something like: " Surface to be planar prior to final plating and metallization. Boards must be suitable for via in pad technology." We do not allow plati
Electronics Forum | Sun Jan 01 22:48:46 EST 2006 | Joseph
We are using selective soldering pallet, which the soldering flux is Interflux 2005M. We encountered the poor hole fill mainly at the heat sink components. Initially we tried to apply more heat but tend to overkill the flux activity. After some modif
Electronics Forum | Mon Mar 12 08:59:46 EDT 2007 | davef
Questions are: * You say 'voids', but you describe poor barrel fill. Are you seeing both? * Sometimes designers need to reduce the heatsink effect of large ground and power places, but this usually shows on the two upper corner pins, not all corners
Electronics Forum | Thu Mar 15 13:27:45 EDT 2007 | Pete
We had a customer do a similar thing. We notified our customer and educated them on what was happening. We were instructed to try one and report on the results, as the vias were supposed to be filled (and weren't). We pasted and reflowed and as su
