Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Fri Oct 22 11:53:53 EDT 2004 | C Lampron
Hi Christina, What would you be basing the yields off of? Is it solder defect, component placement, etc....? I have worked for a flex house for quite a few years. You are right. The Polyimide is very dimentionally unstable. (even more so on humid da
Electronics Forum | Tue Nov 15 03:27:46 EST 2005 | Base
Hey Carsten, Couple of questions to get the picture clear about the type of machine you're looking for: - what's the most demanding package you'll be placing? (fine-pitch, BGA, large connectors, etc...) - how much feederbarspace do you hink you'll n
Electronics Forum | Mon Jan 21 08:28:33 EST 2013 | proy
I am looking at assembling a relatively small baord, but it is very thin and precise. It is .010" FR4, with 1oz copper two sides. ** Components are only on one side** It has some 0201's and a .4mm pitch BGA among other leadless packages. Where
Electronics Forum | Thu Aug 16 20:11:21 EDT 2001 | davef
Hussman is correct. Make those people quit. [Just walk-up, pimp slap 'em, grab their dental pick, and say "Dave says you can't use this any more. I'm just following orders."][Trust me, this is much smoother than the "Tonya Harding Approach" that I
Electronics Forum | Wed Jun 02 15:27:27 EDT 1999 | JohnW
| | Hi, | | | | To improve the Design For Manufacturing I am currently looking to write down some design rules that can (and should be) used by our engineering department. | | | | Can somebody help me get started or give some usefull tips on where
Electronics Forum | Thu Jul 29 21:16:15 EDT 2004 | davef
This sounds like a "perfectly fine" no-lead solder connection. What the composition of: * Solder alloy? * Solderability protection on components?
Electronics Forum | Tue Jul 27 15:15:48 EDT 2004 | JSTARKEY
We have recently encountered a problem that we haven't seen before: The solder joint appears to be wetting ok and the solder is re-flowing but the appearance of the solder after re-flow is pitted. Using Kester 531, humidity around 41% temperature aro
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