Electronics Forum: first pass yield saki (Page 7 of 7)

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Aug 28 12:25:26 EDT 2001 | Steve

To be honest with you, it doesn't really matter how you present the data, as long as you understand what the problems are. Bottom line is who cares what the numbers are unless you are doing something about it. Are you able to track the individual de

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Aug 28 13:46:46 EDT 2001 | mparker

To clarify on "Opportunities"- With 1000 components, the opportunities are far greater than 1000. You have 1 opportunity per component for a component defect i.e. bent lead, damaged part, tested bad, etc. You have a second opportunity per component

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Thu Sep 13 13:29:06 EDT 2001 | mparker

Dave et al, I just print out and read a copy of the aforementioned recommended article. Mr. Mangin gives a clear picture of why DPMO is to be considered a more pure data than First Pass Yield (FPY). However, I must note that his interpretation of h

AOI System

Electronics Forum | Thu Jul 01 13:47:25 EDT 2004 | Tom B

Good Day! I am looking to purchase a Cyberoptics KS-Flex 18 AOI system, I have a couple of question that if you could answer, I would most appreciative. 1) Model and length of time used. Do they use AOI for all pwbs or just the more complex a

AOI systems vs. X-ray

Electronics Forum | Fri Mar 30 11:04:24 EST 2001 | genny

We are already using ICT on the PCB, which should catch most missing components, also components installed backwards, or the wrong value(to a point - we do RF so we have lots of very small value caps and inductors which can't be measured), and in som

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan

Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op

Re: BGA repair/rework

Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon

| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting

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