Electronics Forum | Fri Jun 22 11:18:23 EDT 2007 | agillman
I realize I am jumping in late but here is some REAL information. Waste water is controlled by EACH POTW (waste facility). It is NOT centralized as in EPA. The POTW's are primarily concerned with what might damage their pipes. First among their conce
Electronics Forum | Mon Mar 30 13:14:41 EDT 2020 | dwl
Heat above 53 Celsius kills covid viruses according to the WHO: https://www.who.int/csr/sars/survival_2003_05_04/en/ If you want an added measure of safety, you could bake your boards before packing them. Fundamentally its going to be an issue of
Electronics Forum | Fri Apr 03 08:34:54 EDT 2020 | SMTA-Gregory
We need to be careful with product to avoid introducing a new failure mode, namely corrosion and dendrite growth, especially those running no clean processes! In addition to heat (reflow, wave and some selective soldering processes) killing the vi
Electronics Forum | Fri Apr 03 10:29:29 EDT 2020 | stephendo
Time. The virus does not last a very long time on surfaces. Not sure how long but I read that it does not live long on copper but does last on stainless steel. As far as I know the virus lives as well on gloves as it does on hands. So you still have
Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia
Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But
Electronics Forum | Tue Apr 05 10:36:24 EDT 2011 | frcdave
Hi Don, The YESTech B3 can be used post placement very easily. I would suggest contacting their service team, they could walk you through the process quickly. You are actually very close to being able use it now in that capacity since you have the i
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